SCDS467 august   2023 TMUX7612-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Source or Drain Continuous Current Switch Pairs
    6. 6.6  Source or Drain Pulsed Current
    7. 6.7  Electrical Characteristics (12 V Single Supply)
    8. 6.8  Switching Characteristics (12 V Single Supply)
    9. 6.9  Electrical Characteristics (±15 V Dual Supply)
    10. 6.10 Switching Characteristics (±15 V Dual Supply)
    11. 6.11 Electrical Characteristics (±20 V Dual Supply)
    12. 6.12 Switching Characteristics (±20 V Dual Supply)
    13. 6.13 Electrical Characteristics (+37.5 V/–12.5 V Dual Supply)
    14. 6.14 Switching Characteristics (+37.5 V/–12.5 V Dual Supply)
    15. 6.15 Electrical Characteristics (48 V Single Supply)
    16. 6.16 Switching Characteristics (48 V Single Supply)
    17. 6.17 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Rail-to-Rail Operation
      3. 7.3.3 1.8 V Logic Compatible Inputs
      4. 7.3.4 Flat On-Resistance
      5. 7.3.5 Power-Up Sequence Free
      6. 7.3.6 Ultra-Low Charge Injection
      7. 7.3.7 Ultra-Low Leakage Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application – MEMs Lidar Switching
    2. 8.2 Design Requirements
    3. 8.3 Detailed Design Procedure
    4. 8.4 Application Curve
    5. 8.5 Power Supply Recommendations
    6. 8.6 Layout
      1. 8.6.1 Layout Guidelines
      2. 8.6.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information
    2. 10.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5 Power Supply Recommendations

The TMUX7612-Q1 device operates across a wide supply range of ±4.5 V to ±25 V (4.5 V to 50 V in single-supply mode). The device also perform well with asymmetrical supplies such as VDD = 12 V and VSS = –5 V.

Power-supply bypassing improves noise margin and prevents switching noise propagation from the supply rails to other components. Good power-supply decoupling is important to achieve optimum performance. For improved supply noise immunity, use a supply decoupling capacitor ranging from 0.1 μF to 10 μF at both the VDD and VSS pins to ground. Place the bypass capacitors as close to the power supply pins of the device as possible using low-impedance connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive systems, or for systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall inductance and is beneficial for connections to ground and power planes. Always make sure a solid ground (GND) connection is established before supplies are ramped.