SCDS466A August   2023  – December 2024 TMUX7612

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Source or Drain Current through Switch
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Electrical Characteristics (Global)
    7. 5.7  Electrical Characteristics (±15 V Dual Supply)
    8. 5.8  Switching Characteristics (±15 V Dual Supply)
    9. 5.9  Electrical Characteristics (±20 V Dual Supply)
    10. 5.10 Switching Characteristics (±20 V Dual Supply)
    11. 5.11 Electrical Characteristics (+37.5 V/–12.5 V Dual Supply)
    12. 5.12 Switching Characteristics (+37.5 V/–12.5 V Dual Supply)
    13. 5.13 Electrical Characteristics (12 V Single Supply)
    14. 5.14 Switching Characteristics (12 V Single Supply)
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  Off-Leakage Current
    3. 6.3  On-Leakage Current
    4. 6.4  tON and tOFF Time
    5. 6.5  Propagation Delay
    6. 6.6  Charge Injection
    7. 6.7  Off Isolation
    8. 6.8  Channel-to-Channel Crosstalk
    9. 6.9  Bandwidth
    10. 6.10 THD + Noise
    11. 6.11 Power Supply Rejection Ratio (PSRR)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Rail-to-Rail Operation
      3. 7.3.3 1.8 V Logic Compatible Inputs
      4. 7.3.4 Flat On-Resistance
      5. 7.3.5 Power-Up Sequence Free
      6. 7.3.6 Ultra-Low Charge Injection
      7. 7.3.7 Ultra-Low Leakage Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
      2. 8.2.2 Design Requirements
      3. 8.2.3 Application Curve
    3. 8.3 Thermal Considerations
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1) TMUX7612 UNIT
RUM (QFN) PW (TSSOP)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 42.8 99.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 27.9 27.7 °C/W
RθJB Junction-to-board thermal resistance 17.9 46.5 °C/W
ΨJT Junction-to-top characterization parameter 0.3 1.3 °C/W
ΨJB Junction-to-board characterization parameter 17.9 45.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.8 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.