SCDS473 July   2025 TMUX9612

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings: TMUX961x Devices
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions: TMUX961x Devices
    4. 6.4  Source and Drain Continuous Current
    5. 6.5  Source and Drain Pulse Current
    6. 6.6  Electrical Characteristics (Global): TMUX961x Devices
    7. 6.7  Electrical Characteristics (±110V Dual Supply)
    8. 6.8  Electrical Characteristics (±50V Dual Supply)
    9. 6.9  Electrical Characteristics (100V Single Supply)
    10. 6.10 Switching Characteristics: TMUX961x Devices
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 On-Resistance
    2. 7.2 Off-Leakage Current
    3. 7.3 On-Leakage Current
    4. 7.4 Device Turn-On and Turn-Off Time
    5. 7.5 Charge Injection
    6. 7.6 Off Isolation
    7. 7.7 Crosstalk
    8. 7.8 Bandwidth
    9. 7.9 THD + Noise
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Flat On-Resistance
      3. 8.3.3 Protection Features
        1. 8.3.3.1 Fail-Safe Logic
        2. 8.3.3.2 ESD Protection
        3. 8.3.3.3 Latch-Up Immunity
      4. 8.3.4 1.8V Logic Compatible Inputs
      5. 8.3.5 Integrated Pull-Down Resistor on Logic Pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Truth Tables
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.11 Typical Characteristics

at TA = 25°C, VDD = +110V, and VSS = –110V (unless otherwise noted)

TMUX9612 On-Resistance vs Source or Drain Voltage
VDD = +110V, VSS = –110V
Flattest Ron Region
Figure 6-1 On-Resistance vs Source or Drain Voltage
TMUX9612 On-Resistance vs Source or Drain Voltage
VDD = +110V, VSS = –110V
Figure 6-3 On-Resistance vs Source or Drain Voltage
TMUX9612 On-Resistance vs Source or Drain VoltageFigure 6-5 On-Resistance vs Source or Drain Voltage
TMUX9612 On-Leakage Current vs Source or Drain VoltageFigure 6-7 On-Leakage Current vs Source or Drain Voltage
TMUX9612 On-Resistance vs Source or Drain Voltage
VDD = +90V, VSS = –130V
Flattest Ron Region
Figure 6-2 On-Resistance vs Source or Drain Voltage
TMUX9612 On-Resistance vs Source or Drain Voltage
VDD = +90V, VSS = –130V
Figure 6-4 On-Resistance vs Source or Drain Voltage
TMUX9612 Off-Leakage Current vs Source or Drain VoltageFigure 6-6 Off-Leakage Current vs Source or Drain Voltage