SLASEP7 May   2020 TMUXHS4212

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Application Use Cases
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 High-Speed Performance Parameters
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Enable and Power Savings
      2. 8.3.2 Data Line Biasing
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 USB3.2 implementation for USB Type-C
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 PCIe Lane Muxing
        1. 9.2.2.1 Application Curves
    3. 9.3 Systems Examples
      1. 9.3.1 USB/eSATA
      2. 9.3.2 MIPI Camera Serial Interface
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Design Requirements

The TMUXHS4212 can be designed into many different applications. All the applications have certain requirements for the system to work properly. The TMUXHS4212 requires 3.3 V ±10% VCC rail. The OEn pin must be low for device to work; otherwise, it disables the outputs. This pin can be driven by a processor. The expectation is that one side of the device has AC coupling capacitors. Table 2 provides information on expected values to perform properly.

Table 2. Design Parameters

DESIGN PARAMETER VALUE
VCC 3.3 V
AXp/n, BXp/n, CXp/n CM input voltage 0 V to 1.8 V
Control/OEn pin max voltage for low 0.5 V
Control/OEn pin min voltage for high 1.42 V
AC coupling capacitor 75 nF to 265 nF
RBIAS (Figure 9) when needed 1 kΩ to 100 kΩ