SLOS862B July   2015  – October 2016 TPA3116D2-Q1 , TPA3118D2-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 AC Electrical Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Gain Setting and Master and Slave
      2. 7.3.2  Input Impedance
      3. 7.3.3  Start-Up and Shutdown Operation
      4. 7.3.4  PLIMIT Operation
      5. 7.3.5  GVDD Supply
      6. 7.3.6  BSPx and BSNx Capacitors
      7. 7.3.7  Differential Inputs
      8. 7.3.8  Device Protection System
      9. 7.3.9  DC-Detect Protection
      10. 7.3.10 Short-Circuit Protection and Automatic Recovery Feature
      11. 7.3.11 Thermal Protection
      12. 7.3.12 TPA311xD2-Q1 Modulation Scheme
        1. 7.3.12.1 MODSEL = GND: BD Modulation
        2. 7.3.12.2 MODSEL = HIGH: 1SPW Modulation
      13. 7.3.13 AM Avoidance EMI Reduction
    4. 7.4 Device Functional Mode
      1. 7.4.1 Mono Mode (PBTL)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the PWM Frequency
        2. 8.2.2.2 Select the Amplifier Gain and Master or Slave Mode
        3. 8.2.2.3 Select Input Capacitance
        4. 8.2.2.4 Select Decoupling Capacitors
        5. 8.2.2.5 Select Bootstrap Capacitors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Heat Sink Used on the EVM
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Trademarks
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Supports Multiple Output Configurations
    • 2 × 50 W Into a 4-Ω BTL Load at 21 V (TPA3116D2-Q1)
    • 2 × 30 W Into an 8-Ω BTL Load at 24 V (TPA3118D2-Q1)
  • Wide Voltage Range: 4.5 V to 26 V
  • Efficient Class-D Operation
    • >90% Power Efficiency Combined With Low Idle Loss Greatly Reduces Heat Sink Size
    • Advanced Modulation Schemes
  • Multiple Switching Frequencies
    • AM Avoidance
    • Master and Slave Synchronization
    • Up to 1.2-MHz Switching Frequency
  • Feedback Power-Stage Architecture With High PSRR Reduces PSU Requirements
  • Programmable Power Limit
  • Differential and Single-Ended Inputs
  • Stereo BTL and Mono PBTL Modes
  • Single Power Supply Reduces Component Count
  • Integrated Self-Protection Circuits Including Overvoltage, Undervoltage, Overtemperature, DC-Detect, and Short Circuit With Error Reporting
  • Designed for Automotive EMC Requirements
  • Thermally Enhanced Packages
    • DAD (32-pin HTSSOP Pad Up)
    • DAP (32-pin HTSSOP Pad Down)
    • –40°C to 125°C Ambient Temperature Range
  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level H2
    • Device CDM ESD Classification Level C4B

2 Applications

  • Automotive Audio
  • Emergency Call
  • Driver Notifications

3 Description

The TPA311xD2-Q1 devices are automotive stereo, efficient, digital-amplifier power stages for driving speakers up to 100 W into 2 Ω in mono. The TPA3118D2-Q1 can even drive 2 × 30 W into 8 Ω without a heat sink on a dual-layer PCB. If even higher power is needed, the TPA3116D2-Q1 drives 2 × 50 W into 4 Ω with a small heat sink attached to its top-side thermal pad.

The TPA311xD2-Q1 advanced oscillator and PLL circuit employ a multiple-switching-frequency option to avoid AM interference; this is achieved together with an option of either master or slave selection, making it possible to synchronize multiple devices.

The TPA311xD2-Q1 devices are fully protected against faults with short-circuit protection and thermal protection as well as overvoltage, undervoltage and dc protection. Faults are reported back to the processor to prevent devices from being damaged during overload conditions.

Device Information(1)

DEVICE PACKAGE BODY SIZE (NOM)
TPA3116D2-Q1 HTSSOP (32) 11.00 mm × 6.20 mm
TPA3118D2-Q1
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Simplified Application Circuit

TPA3116D2-Q1 TPA3118D2-Q1 app_cir_SLOS862.gif

4 Revision History

Changes from A Revision (August 2015) to B Revision

  • Changed Table 3, column R to GND From: Short To: Open and column R to GVDD From: Open To: ShortGo
  • Changed Figure 19 Go

Changes from * Revision (July 2015) to A Revision

  • Added all information following the pin description diagramsGo