SLOS821B June   2013  – September 2014 TPA6133A2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Application Diagram
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specification
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Headphone Amplifiers
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modes of Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input-Blocking Capacitors
        2. 9.2.2.2 Charge Pump Flying Capacitor and CPVSS Capacitor
        3. 9.2.2.3 Decoupling Capacitors
        4. 9.2.2.4 Optional Test Setup
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelimes
      1. 11.1.1 Exposed Pad On TPA6133A2RTJ Package
      2. 11.1.2 GND Connections
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from A Revision (August 2014) to B Revision

  • Changed "PIN QFN" To: "NUMBER" in the Pin Functions tableGo
  • Added a NOTE to the Applications and Implementation section Go
  • Added new paragraph to the Application Information sectionGo

Changes from * Revision (June 2013) to A Revision

  • Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Added the Device Information Table Go
  • Moved "Minimum Load Impedance" From the Absolute Maximum Ratings table To the Recommended Operating Conditions tableGo
  • Added the Thermal Information Table Go
  • Changed text in the Overview section From: "toggling the SD pin to logic 1." To: "asserting the SD pin to logic 1."Go
  • Changed text in the Headphone Amplifier section From: "the output signal is severely clipped" To: "power consumption will be higher"Go
  • Added the Optional Test Setup sectionGo
  • Added the Layout Example image Go