SLVS640F October   2007  – February 2015 TPD12S520

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 ±8-kV Contact ESD Protection on External Lines
      2. 7.3.2 Single-Chip ESD Solution for HDMI Driver
      3. 7.3.3 Supports All HDMI 1.3 and HDMI 1.4b Data Rates
      4. 7.3.4 38-Pin TSSOP Provides Seamless Layout Option With HDMI Connector
      5. 7.3.5 24-Pin WQFNPackage for Space Constrained Applications
      6. 7.3.6 Integrated Level Shifting for the Control Lines
      7. 7.3.7 Backdrive Protection
      8. 7.3.8 Lead-Free Package
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

TPD12S520 po2_slvs640.gif

Pin Functions

NAME PIN NO. TYPE ESD LEVEL DESCRIPTION
DBT RMN
5V_SUPPLY 1 12 PWR 2 kV(4) Bias for TMDS protection
LV_SUPPLY 2 13 PWR 2 kV(4) Bias for CE/DDC/HOTPLUG level shifters
GND, TMDS_GND 3, 5, 8, 11,14,
25, 28, 31, 34, 36
6, 9, 10, 14, 17 GND NA TMDS ESD and parasitic GND return(5)
TMDS_D2+ 4, 35 18 IO 8 kV(3) TMDS 0.8-pF ESD protection(1)
TMDS_D2– 6, 33 19 IO 8 kV(3) TMDS 0.8-pF ESD protection(1)
TMDS_D1+ 7, 32 15 IO 8 kV(3) TMDS 0.8-pF ESD protection(1)
TMDS_D1– 9, 30 16 IO 8 kV(3) TMDS 0.8-pF ESD protection(1)
TMDS_D0+ 10, 29 8 IO 8 kV(3) TMDS 0.8-pF ESD protection(1)
TMDS_D0– 12, 27 7 IO 8 kV(3) TMDS 0.8-pF ESD protection(1)
TMDS_CK+ 13, 26 5 IO 8 kV(3) TMDS 0.8-pF ESD protection(1)
TMDS_CK– 15, 24 4 IO 8 kV(3) TMDS 0.8-pF ESD protection(1)
CE_REMOTE_IN 16 20 IO 2 kV(4) LV_SUPPLY referenced logic level into ASIC
DDC_CLK_IN 17 21 IO 2 kV(4) LV_SUPPLY referenced logic level into ASIC
DDC_DAT_IN 18 22 IO 2 kV(4) LV_SUPPLY referenced logic level into ASIC
HOTPLUG_DET_IN 19 23 IO 2 kV(4) LV_SUPPLY referenced logic level into ASIC
HOTPLUG_DET_OUT 20 24 IO 8 kV(3) 5 V_SUPPLY referenced logic level out, plus 3.5-pF ESD(2) to connector
DDC_DAT_OUT 21 1 IO 8 kV(3) 5 V_SUPPLY referenced logic level out, plus 3.5-pF ESD to connector
DDC_CLK_OUT 22 2 IO 8 kV(3) 5 V_SUPPLY referenced logic level out, plus 3.5-pF ESD to connector
CE_REMOTE_OUT 23 3 IO 8 kV(3) 5 V_SUPPLY referenced logic level out, plus 3.5-pF ESD to connector
ESD_BYP 37 11 IO 2 kV(4) ESD bypass. This pin must be connected to a 0.1-μF ceramic capacitor.
NC 38 NA No connection
(1) These two pins must be connected together inline on the PCB.
(2) This output can be connected to an external 0.1-μF ceramic capacitor, resulting in an increased ESD withstand voltage rating.
(3) Standard IEC 61000-4-2, CDISCHARGE = 150 pF, RDISCHARGE = 330 Ω, 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND = 0 V, and ESD_BYP (pin 37) and HOTPLUG_DET_OUT (pin 20) each bypassed with a 0.1-μF ceramic capacitor connected to GND.
(4) Human body model (HBM) per MIL-STD-883, Method 3015, CDISCHARGE = 100 pF, RDISCHARGE = 1.5 kΩ, 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND = 0 V, and ESD_BYP (pin 37) and HOTPLUG_DET_OUT (pin 20) each bypassed with a 0.1-μF ceramic capacitor connected to GND.
(5) These pins should be routed directly to the associated GND pins on the HDMI connector, with single-point ground vias at the connector.