SLVSDG4B March   2016  – August 2016 TPD1E04U04


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  IEC 61000-4-2 ESD Protection
      2. 7.3.2  IEC 61000-4-4 EFT Protection
      3. 7.3.3  IEC 61000-4-5 Surge Protection
      4. 7.3.4  IO Capacitance
      5. 7.3.5  Ultra-Low ESD Clamping Voltage
      6. 7.3.6  Low RDYN
      7. 7.3.7  DC Breakdown Voltage
      8. 7.3.8  Ultra Low Leakage Current
      9. 7.3.9  Supports High Speed Interfaces
      10. 7.3.10 Industrial Temperature Range
      11. 7.3.11 Easy Flow-Through Routing Package
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. Signal Range
        2. Operating Frequency
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPY|2
  • DPL|2
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application and Implementation


Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

Application Information

The TPD1E04U04 is a diode type TVS which is used to provide a path to ground for dissipating ESD events on high-speed signal lines between a human interface connector and a system. As the current from ESD passes through the TVS, only a small voltage drop is present across the diode. This is the voltage presented to the protected IC. The low RDYN of the triggered TVS holds this voltage, VCLAMP, to a safe level for the protected IC.

Typical Application

TPD1E04U04 hdmi-app-diagram.gif Figure 13. HDMI 2.0 ESD Schematic

Design Requirements

For this design example eight TPD1E04U04 devices and five TPD1E05U06 devices are being used in a HDMI 2.0 application. This provides a complete ESD protection scheme.

Given the HDMI 2.0 application, the parameters listed in Table 1 are known.

Table 1. Design Parameters

Signal range on TMDS lines 0 V to 3.6 V
Operating frequency on TMDS lines up to 3 GHz
Signal range on control lines 0 V to 5.5 V

Detailed Design Procedure

Signal Range

The TPD1E04U04 supports signal ranges between 0 V and 3.6 V, which supports the TMDS pairs on the HDMI 2.0 application. The TPD1E05U06 supports signal ranges between 0 V and 5.5 V, which supports the control lines.

Operating Frequency

The TPD1E04U04 has a 0.5-pF (typical) capacitance, which supports the HDMI 2.0 data rates of 6-Gbps. The TPD1E05U06 has a 0.5-pF (typical) capacitance as well, which easily supports the control line data rates.

Application Curves

TPD1E04U04 HDMI2_noDUT_FS.gif
Figure 14. HDMI2.0 6-Gbps TP2 Eye Diagram (Bare Board)
TPD1E04U04 HDMI2_TPD1E04U04_FS.gif
Figure 15. HDMI2.0 6-Gbps TP2 Eye Diagram
(With TPD1E04U04)