SLVSDG4B March   2016  – August 2016 TPD1E04U04


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  IEC 61000-4-2 ESD Protection
      2. 7.3.2  IEC 61000-4-4 EFT Protection
      3. 7.3.3  IEC 61000-4-5 Surge Protection
      4. 7.3.4  IO Capacitance
      5. 7.3.5  Ultra-Low ESD Clamping Voltage
      6. 7.3.6  Low RDYN
      7. 7.3.7  DC Breakdown Voltage
      8. 7.3.8  Ultra Low Leakage Current
      9. 7.3.9  Supports High Speed Interfaces
      10. 7.3.10 Industrial Temperature Range
      11. 7.3.11 Easy Flow-Through Routing Package
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. Signal Range
        2. Operating Frequency
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPY|2
  • DPL|2
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Description


The TPD1E04U04 is a unidirectional ESD Protection Diode with ultra-low capacitance designed for HDMI 2.0 and USB 3.0. This device can dissipate ESD strikes above the maximum level specified by the IEC 61000-4-2 International Standard. The extremely low clamping voltage and low RDYN make this device ideal for supporting the next-generation small feature size SoCs. The low capacitance also makes this device ideal for protecting any high-speed signal pins on these sensitive interface pins.

Functional Block Diagram

TPD1E04U04 fbd3_slvsbo7.gif

Feature Description

IEC 61000-4-2 ESD Protection

The IO pins can withstand ESD events up to ±16-kV contact and ±16-kV air gap. An ESD-surge clamp diverts the current to ground.

IEC 61000-4-4 EFT Protection

The IO pins can withstand an electrical fast transient burst of up to 80 A (5/50 ns waveform, 4 kV with 50-Ω impedance). An ESD-surge clamp diverts the current to ground.

IEC 61000-4-5 Surge Protection

The IO pins can withstand surge events up to 2.5 A and 19 W (8/20 µs waveform). An ESD-surge clamp diverts this current to ground.

IO Capacitance

The capacitance between each IO pin to ground is 0.5-pF (typical) and 0.65-pF (maximum). This device supports data rates up to 6 Gbps.

Ultra-Low ESD Clamping Voltage

The IO pins feature an ESD clamp that is capable of clamping the voltage to 8.9 V (ITLP = 16 A) and –4.6 V (ITLP = –16 A).


The IO pins feature an ESD clamp that has an extremely low RDYN of 0.25 Ω (IO to GND) and 0.18 Ω (GND to IO) which prevents system damage during ESD events.

DC Breakdown Voltage

The DC breakdown voltage of each IO pin is a minimum of 5 V. This ensures that sensitive equipment is protected from surges above the reverse standoff voltage of 3.6 V.

Ultra Low Leakage Current

The IO pins feature an ultra-low leakage current of 10 nA (maximum) with a bias of 2.5 V.

Supports High Speed Interfaces

This device is capable of supporting high speed interfaces up to 6 Gbps, because of the very low IO capacitance.

Industrial Temperature Range

This device features an industrial operating range of –40°C to +125°C.

Easy Flow-Through Routing Package

The layout of this device makes it simple and easy to add protection to an existing layout. The packages offers flow-through routing, requiring minimal modification to an existing layout.

Device Functional Modes

The TPD1E04U04 is a passive integrated circuit that triggers when voltages are above VBR or below VF. During ESD events, voltages as high as ±16-kV (air) can be directed to ground via the internal diode network. When the voltages on the protected line fall below the trigger levels of TPD1E04U04 (usually within 10s of nano-seconds) the device reverts to passive.