SLVSAM5A January   2011  – April 2016 TPD3F303

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6  Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - Surge Protection
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional EMI Filtering and Line Termination With Integrated ESD Protection
      2. 7.3.2 IEC 61000-4-2 ESD Protection
      3. 7.3.3 DC Breakdown Voltage
      4. 7.3.4 Low Leakage Current
      5. 7.3.5 Low Noise C-R-C Filter Topology
      6. 7.3.6 Integrated VCC Clamp
      7. 7.3.7 Space-Saving Packages
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Signal Range
        2. 8.2.2.2 Required ESD Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Detailed Description

7.1 Overview

The TPD3F303 is a highly-integrated three-channel EMI filter and unidirectional TVS based protection diode array. This device can be used for a range of applications such as cell phones, tablets, hotspots, and PDAs.

7.2 Functional Block Diagram

TPD3F303 eq_cir_lvsam5.gif

7.3 Feature Description

7.3.1 Bidirectional EMI Filtering and Line Termination With Integrated ESD Protection

This device provides bidirectional EMI filtering, integrated line-termination resistors, and integrated ESD protection.

7.3.2 IEC 61000-4-2 ESD Protection

The ESD protection on all pins exceeds the IEC 61000-4-2 level 4 standard. Contact and air-gap ESD is rated at ±15 kV.

7.3.3 DC Breakdown Voltage

The DC breakdown voltage of this device is 6 V minimum.

7.3.4 Low Leakage Current

The I/O pins of this device feature a low leakage current of 0.1-µA maximum.

7.3.5 Low Noise C-R-C Filter Topology

This device has a C-R-C filter topology composed of a series resistor with two capacitors in parallel with the I/O pins. The typical resistor value for the DATA1 and DATA2 pins is 100 Ω and 45 Ω for the CLK pins. The typical capacitance on all lines is 20 pF when biased at 0 V.

7.3.6 Integrated VCC Clamp

This device integrates an ESD clamp for the VCC pin, which eliminates the need for additional components.

7.3.7 Space-Saving Packages

The layout of this device makes it easy to add protection to existing layouts. The packages offer flow-through routing which requires minimal changes to existing layout for addition of these devices. Additionally, the device is offered in two small space-saving packages that take up minimal footprint on the board.

7.4 Device Functional Modes

The TPD3F303 is a passive integrated circuit that triggers when voltages are above VBR or below Vf (–0.7 V). During ESD events, voltages as high as ±15 kV (air or contact) can be directed to ground through the internal diode network. When the voltages on the protected line fall below the trigger levels of TPD3F303 (usually within 10s of nanoseconds) the device reverts to passive.