SLIS134C March   2011  – September 2015

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Operating Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Voltage Divider Mode
      3. 7.4.3 Rheostat Mode
    5. 7.5 Programming with I2C
      1. 7.5.1 I2C General Operation
        1. 7.5.1.1 I2C Interface
        2. 7.5.1.2 START and STOP Conditions
        3. 7.5.1.3 Data Validity and Byte Formation
        4. 7.5.1.4 Acknowledge (ACK) and Not Acknowledge (NACK)
      2. 7.5.2 I2C Write and Read Operation
        1. 7.5.2.1 Auto Increment Function
        2. 7.5.2.2 Write Operation
        3. 7.5.2.3 Repeated Start
        4. 7.5.2.4 Read Operation
    6. 7.6 Register Maps
      1. 7.6.1 Slave Address
      2. 7.6.2 TPL0102 Register Map
      3. 7.6.3 IVRA (Initial Value Register for Potentiometer A)
      4. 7.6.4 WRA (Wiper Resistance Register for Potentiometer A)
      5. 7.6.5 IVRB (Initial Value Register for Potentiometer B)
      6. 7.6.6 WRB (Wiper Resistance Register for Potentiometer B)
      7. 7.6.7 ACR (Access Control Register)
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Adjustable Gain Non-Inverting Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Digital to Analog Converter (DAC)
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Variable Current Sink
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Compensation Components
        3. 8.2.3.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Power Sequence
    2. 9.2 Wiper Position Upon Power Up
    3. 9.3 Dual-Supply vs Single-Supply
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.