SLVS514M June   2010  – June 2016 TPS2041B , TPS2042B , TPS2043B , TPS2044B , TPS2051B , TPS2052B , TPS2053B , TPS2054B

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. General Switch Catalog
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dissipation Ratings
    7. 7.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Power Switch
      2. 9.3.2 Charge Pump
      3. 9.3.3 Driver
      4. 9.3.4 Enable (ENx)
      5. 9.3.5 Enable (ENx)
      6. 9.3.6 Overcurrent (OCx)
      7. 9.3.7 Current Sense
      8. 9.3.8 Thermal Sense
      9. 9.3.9 Undervoltage Lockout
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Universal Serial Bus (USB) Applications
    2. 10.2 Typical Application
      1. 10.2.1 Typical Application (TPS2042B)
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Power-Supply Considerations
          2. 10.2.1.2.2 Overcurrent
          3. 10.2.1.2.3 OC Response
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Host and Self-Powered and Bus-Powered Hubs
        1. 10.2.2.1 Design Requirements
          1. 10.2.2.1.1 USB Power-Distribution Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Low-Power Bus-Powered and High-Power Bus-Powered Functions
        3. 10.2.2.3 Application Curves
      3. 10.2.3 Generic Hot-Plug Applications
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Undervoltage Lockout (UVLO)
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Power Dissipation
    4. 12.4 Thermal Protection
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Related Links
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device and Documentation Support

Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.