Product details

Vin (Min) (V) 2.7 Vin (Max) (V) 5.5 Continuous current (Max) (A) 0.5 Current limit (A) 1 Product type Fixed current limit, Power switch Operating temperature range (C) -40 to 125, -40 to 85 Enable Active High Number of switches 2 Rating Catalog
Vin (Min) (V) 2.7 Vin (Max) (V) 5.5 Continuous current (Max) (A) 0.5 Current limit (A) 1 Product type Fixed current limit, Power switch Operating temperature range (C) -40 to 125, -40 to 85 Enable Active High Number of switches 2 Rating Catalog
HVSSOP (DGN) 8 9 mm² 3 x 3 SOIC (D) 8 19 mm² 3.91 x 4.9 VSON (DRB) 8 9 mm² 3 x 3
  • 70-mΩ High-Side MOSFET
  • 500-mA Continuous Current
  • Thermal and Short-Circuit Protection
  • Accurate Current Limit
    (0.75 A Minimum, 1.25 A Maximum)
  • Operating Range: 2.7 V to 5.5 V
  • 0.6-ms Typical Rise Time
  • Undervoltage Lockout
  • Deglitched Fault Report (OC)
  • No OC Glitch During Power Up
  • Maximum Standby Supply Current:
    1-µA (Single, Dual) or 2-µA (Triple, Quad)
  • Ambient Temperature Range: –40°C to 85°C
  • UL Recognized, File Number E169910
  • Additional UL Recognition for TPS2042B and TPS2052B for Ganged Configuration
  • 70-mΩ High-Side MOSFET
  • 500-mA Continuous Current
  • Thermal and Short-Circuit Protection
  • Accurate Current Limit
    (0.75 A Minimum, 1.25 A Maximum)
  • Operating Range: 2.7 V to 5.5 V
  • 0.6-ms Typical Rise Time
  • Undervoltage Lockout
  • Deglitched Fault Report (OC)
  • No OC Glitch During Power Up
  • Maximum Standby Supply Current:
    1-µA (Single, Dual) or 2-µA (Triple, Quad)
  • Ambient Temperature Range: –40°C to 85°C
  • UL Recognized, File Number E169910
  • Additional UL Recognition for TPS2042B and TPS2052B for Ganged Configuration

The TPS20xxB power-distribution switches are intended for applications where heavy capacitive loads and short circuits are likely to be encountered. These devices incorporates 70-mΩ N-channel MOSFET power switches for power-distribution systems that require multiple power switches in a single package. Each switch is controlled by a logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no external components and allows operation from supplies as low as 2.7 V.

When the output load exceeds the current-limit threshold or a short is present, the device limits the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When continuous heavy overloads and short circuits increase the power dissipation in the switch, causing the junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains off until valid input voltage is present. This power-distribution switch is designed to set current limit at 1 A (typical).

The TPS20xxB power-distribution switches are intended for applications where heavy capacitive loads and short circuits are likely to be encountered. These devices incorporates 70-mΩ N-channel MOSFET power switches for power-distribution systems that require multiple power switches in a single package. Each switch is controlled by a logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no external components and allows operation from supplies as low as 2.7 V.

When the output load exceeds the current-limit threshold or a short is present, the device limits the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When continuous heavy overloads and short circuits increase the power dissipation in the switch, causing the junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains off until valid input voltage is present. This power-distribution switch is designed to set current limit at 1 A (typical).

Download

Similar products you might be interested in

open-in-new Compare products
Pin-for-pin with same functionality to the compared device.
TPS2052C ACTIVE 2-ch 0.5A loading, 4.5-5.5V, 70mΩ USB power switch, active-high, output discharge, reverse blocking This product offers same functionality, pinout with output discharge, reverse blocking and lower 1 ku price.
Similar functionality to the compared device.
TPS2051C ACTIVE 0.5A loading, 4.5-5.5V, 97mΩ USB power switch, active-high, output discharge, reverse blocking This product offers similar functionality with single-channel 0.5-A loading.

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 3
Type Title Date
* Data sheet TPS20xxB Current-Limited, Power-Distribution Switches datasheet (Rev. M) PDF | HTML 19 Jun 2016
Certificate US-36986-UL Certificate of Compliance IEC 62368-1 12 Mar 2021
EVM User's guide Two-Channel, Power-Distribution Switch EVM (Rev. A) 01 Jun 2012

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TPS2052BEVM-293 — TPS2052BEVM Evaluation Module

The TPS2052BEVM-293 is an evaluation module (EVM) for the Texas Instruments family of two-channel, current-limited, power-distribution switches. This EVM operates over a 2.7 V to 5.5 V range and provide a continuous output current of up to 1.5 A. Test points provide convenient (...)

User guide: PDF
Not available on TI.com
Development kit

MSP-EXP432E401Y — SimpleLink™ Ethernet MSP432E401Y MCU Launchpad™ Development Kit

The SimpleLink™ Ethernet MSP432E401Y microcontroller LaunchPad™ Development Kit is an intuitive evaluation platform for SimpleLink™ Arm® Cortex®-M4F-based Ethernet MCUs. The Ethernet LaunchPad development kit highlights the MSP432E401Y MCU with integrated Ethernet MAC and (...)

User guide: PDF | HTML
Simulation model

TPS2052B Unencrypted PSpice Transient Model Package (Rev. A)

SLVM476A.ZIP (33 KB) - PSpice Model
Reference designs

TIDM-TM4C129SDRAMNVM — Execute from SDRAM with code storage in NVM for high performance MCU

This reference design demonstrates how to implement and interface Non Volatile Memory and SDRAM to the performance microcontroller TM4C1294NCPDT in TM4C product family. The implementation is made possible by using the EPI Interface of the Microcontroller to interface a 256Mbit SDRAM at 60MHz and (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDM-MINI-DC — Data Concentrator Reference Design for Smaller AMI Networks Reduces Infrastructure Cost

The TIDM-MINI-DC reference design implements a light-weight powerline communication (PLC) data concentrator (DC) solution integrated with an Ethernet repeater feature. A power grid network is static, which means that once end-nodes are installed the number of nodes to be supported by a DC is (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDM-TM4C129XBLE — BLE Enabled IoT Node With High Performance MCU Reference Design

A system example to show how to build a BLE Node by integrating a TM4C1294 MCU from the TM4C product family and a CC2650 device. This reference design demostatrates the capability of remotely controlling MCU operation via the internet.
Design guide: PDF
Schematic: PDF
Reference designs

TIDM-TM4CFLASHSRAM — Concurrent Parallel XIP Flash and SRAM Design for code download & execution on High Performance MCUs

This reference design demonstrates how to implement and interface Asynchronous Parallel Flash and SRAM Memories to the performance microcontroller TM4C129. The implementation is made possible by using the EPI Interface in Host Bus 16 Mode with mutliple Chip Selects to interface a 1Gbit-8Mbit range (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDM-TM4C129XS2E — RTOS-Based Configurable Serial-to-Ethernet Converter on High Performance MCUs Reference Design

Legacy products may only contain a serial port. Accessing such end equipments (EEs) is increasingly becoming a challenge due to the inability to add them to a shared network and access them over long distances (like remote control stations). A Serial-to-Ethernet  (S2E) converter provides a (...)
Design guide: PDF
Schematic: PDF
Package Pins Download
HVSSOP (DGN) 8 View options
SOIC (D) 8 View options
SON (DRB) 8 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos