SLVS714B February   2007  – June 2024 TPS2062-1 , TPS2065-1 , TPS2066-1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. 6 Parameter Measurement Information
    1.     13
  8. 7 Detailed Description
    1. 7.1  Functional Block Diagram
    2. 7.2  Power Switch
    3. 7.3  Charge Pump
    4. 7.4  Driver
    5. 7.5  Enable ( ENx or ENx)
    6. 7.6  Current Sense
    7. 7.7  Overcurrent
      1. 7.7.1 Overcurrent Conditions (TPS2062-1 and TPS2065-1)
      2. 7.7.2 Overcurrent Conditions (TPS2066-1)
    8. 7.8  Overcurrent ( OCx)
    9. 7.9  Thermal Sense
    10. 7.10 Undervoltage Lockout
    11. 7.11 Discharge Function
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Power-Supply Considerations
      2. 8.1.2  OC Response
      3. 8.1.3  Power Dissipation and Junction Temperature
      4. 8.1.4  Thermal Protection
      5. 8.1.5  Undervoltage Lockout (UVLO)
      6. 8.1.6  Universal Serial Bus (USB) Applications
      7. 8.1.7  Host/Self-Powered and Bus-Powered Hubs
      8. 8.1.8  Low-Power Bus-Powered and High-Power Bus-Powered Functions
      9. 8.1.9  USB Power-Distribution Requirements
      10. 8.1.10 Generic Hot-Plug Applications
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Electrical Characteristics

over recommended operating junction temperature range, VI(IN) = 5.5 V, IO = 1 A, VI(/ENx) = 0 V, or VI(ENx) = 5.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
POWER SWITCH
rDS(on) Static drain-source on-state resistance, 5-V operation and 3.3-V operation VI(IN) = 5 V or 3.3 V, IO = 1 A, –40°C ≤ TJ ≤ 125°C 70 135 mΩ
Static drain-source on-state resistance, 2.7-V operation (2) VI(IN) = 2.7 V, IO = 1 A, -40°C ≤ TJ ≤ 125°C 75 150 mΩ
tr(2) Rise time, output VI(IN) = 5.5 V CL = 1 μF, RL = 5 Ω, TJ = 25°C 0.6 1.5 ms
VI(IN) = 2.7 V 0.4 1
tf(2) Fall time, output VI(IN) = 5.5 V 0.05 0.5
VI(IN) = 2.7 V 0.05 0.5
ENABLE INPUT EN OR EN
VIH High-level input voltage 2.7 V ≤ VI(IN) ≤5.5 V 2 V
VIL Low-level input voltage 2.7 V ≤ VI(IN) ≤ 5.5 V 0.8
II Input current VI( ENx) = 0 V or 5.5 V, VI(ENx) = 0 V or 5.5 V -0.5 0.5 μA
ton(2) Turnon time CL = 100 μF, RL = 5 Ω 3 ms
toff(2) Turnoff time CL = 100 μF, RL = 5 Ω 10
CURRENT LIMIT
IOS Short-circuit output current VI(IN) = 5 V, OUT connected to GND,
device enabled into short-circuit		 TJ = 25°C 1.1 1.5 1.9 A
-40°C ≤ TJ ≤ 125°C 1.1 1.5 2.1
IOC(2)(4) Overcurrent trip threshold VI(IN) = 5 V, current ramp (≤ 100 A/s) on OUT TPS2062-1, TPS2065-1 2.4 3 A
SUPPLY CURRENT (TPS2065-1)
Supply current, low-level output No load on OUT, VI( ENx) = 5.5 V,
or VI(ENx) = 0 V		 TJ = 25°C 0.5 1 μA
-40°C ≤ TJ ≤ 125°C 0.5 10
Supply current, high-level output No load on OUT, VI( ENx) = 0 V,
or VI(ENx) = 5.5 V		 TJ = 25°C 43 60 μA
-40°C ≤ TJ ≤ 125°C 43 70
Reverse leakage current VI(OUTx) = 5.5 V, IN = ground(2) TJ = 25°C 0 μA
SUPPLY CURRENT (TPS2062-1)
Supply current, low-level output No load on OUT, VI( ENx) = 5.5 V,
or VI(ENx) = 0 V		 TJ = 25°C 0.5 1 μA
-40°C ≤ TJ ≤ 125°C 0.5 20
Supply current, high-level output No load on OUT, VI( ENx) = 0 V,
or VI(ENx) = 5.5 V		 TJ = 25°C 50 70 μA
-40°C ≤ TJ ≤ 125°C 50 90
Reverse leakage current VI(OUTx) = 5.5 V, IN = ground(2) TJ = 25°C 0.2 μA
SUPPLY CURRENT (TPS2066-1)
Supply current, low-level output No load on OUT, VI( ENx) = 5.5 V,
or VI(ENx) = 0 V		 TJ = 25°C 0.5 1 μA
-40°C ≤ TJ ≤ 125°C 0.5 20
Supply current, high-level output No load on OUT, VI( ENx) = 0 V,
or VI(ENx) = 5.5 V		 TJ = 25°C 95 120 μA
-40°C ≤ TJ ≤ 125°C 95 120
Reverse leakage current VI(OUTx) = 5.5 V, IN = ground(2) TJ = 25°C 0.2 μA
UNDERVOLTAGE LOCKOUT (TPS2062-1 and TPS2065-1)
Low-level input voltage, IN 2 2.5 V
Hysteresis, IN TJ = 25°C 75 mV
UNDERVOLTAGE LOCKOUT (TPS2066-1)
Low-level input voltage, IN 2 2.6 V
Hysteresis, IN TJ = 25°C 75 mV
OVERCURRENT OC1 and OC2
Output low voltage, VOL(OCx) IO( OCx) = 5 mA 0.4 V
Off-state current(2) VO( OCx) = 5 V or 3.3 V 1 μA
OC deglitch(2) OCx assertion or deassertion 4 8 15 ms
Discharge resistance VCC = 5 V, disabled, IO = 1 mA 100 Ω
THERMAL SHUTDOWN(3)
Thermal shutdown threshold(2) 135 °C
Recovery from thermal shutdown(2) 125 °C
Hysteresis(2) 10 °C
(1) Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
(2) Not tested in production, specified by design.
(3) The thermal shutdown only reacts under overcurrent conditions.
(4) TPS2066-1 does not have overcurrent trip threshold. Current limit is defined by IOS. See Section 7.7 for more details.