SLVS827D February   2009  – June 2015 TPS22904

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 ON/OFF Control
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input Capacitor (Optional)
      2. 10.1.2 Output Capacitor (Optional)
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 VIN to VOUT Voltage Drop
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN Input voltage –0.3 4 V
VOUT Output voltage VIN + 0.3 V
VON Input voltage –0.3 4 V
PD Power dissipation at TA = 25°C 0.48 W
IMAX Maximum continuous switch current 0.5 A
TA Operating free-air temperature –40 85 °C
Tlead Maximum lead temperature (10-s soldering time) 300 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Input voltage 1.1 3.6 V
VOUT Output voltage VIN V
VIH High-level input voltage, ON 0.85 3.6 V
VIL Low-level input voltage, ON 0.4 V
CIN Input capacitor 1 μF

7.4 Thermal Information

THERMAL METRIC(1) TPS22903 UNIT
YFP (DSBGA)
20 PINS
RθJA Junction-to-ambient thermal resistance 192.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 2.3 °C/W
RθJB Junction-to-board thermal resistance 35.8 °C/W
ψJT Junction-to-top characterization parameter 11.8 °C/W
ψJB Junction-to-board characterization parameter 35.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

VIN = 1.1 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS TA MIN TYP(1) MAX UNIT
IIN Quiescent current IOUT = 0, VIN = VON Full 1 μA
IIN(OFF) OFF-state supply current VON = GND, OUT = Open Full 1 μA
IIN(LEAKAGE) OFF-state switch current VON = GND, VOUT = 0 Full 1 μA
rON ON-state resistance IOUT = –200 mA VIN = 3.6 V 25°C 66 90 mΩ
Full 95
VIN = 2.5 V 25°C 75 95
Full 110
VIN = 1.8 V 25°C 90 115
Full 125
VIN = 1.2 V 25°C 135 175
Full 185
VIN = 1.1 V 25°C 157 275
Full 300
rPD Output pulldown resistance VIN = 3.3 V, VON = 0 (TPS22904 only), IOUT = 30 mA 85 135 Ω
ION ON-state input leakage current VON = 1.1 V to 3.6 V or GND Full 1 μA
(1) Typical values are at VIN = 3.3 V and TA = 25°C.

7.6 Switching Characteristics

VIN = 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS TPS22903 TPS22904 UNIT
MIN TYP(1) MAX MIN TYP(1) MAX
tON Turnon time IOUT = 100 mA, CL = 0.1 μF 0.9 1.5 0.9 1.5 μs
tOFF Turnoff time IOUT = 100 mA, CL = 0.1 μF 5.8 8 5.3 7 μs
tr VOUT rise time IOUT = 100 mA, CL = 0.1 μF 0.80 5 0.8 5 μs
tf VOUT fall time IOUT = 100 mA, CL = 0.1 μF 8.3 10 5.8 7 μs
(1) Typical values are at TA = 25°C.

7.7 Typical Characteristics

TPS22903 TPS22904 g_ron_vin_lvs827.gif
Figure 1. rON vs VIN
TPS22903 TPS22904 Vdrop-Graph-TPS22903.gifFigure 3. Voltage Drop vs Load Current
TPS22903 TPS22904 g_quiescurrent_ta_lvs827.gifFigure 5. Quiescent Current vs Temperature
(VIN = 3.3 V, IOUT = 0)
TPS22903 TPS22904 g_iinoff_ta_lvs827.gifFigure 7. IIN(OFF) vs Temperature (VIN = 3.3 V)
TPS22903 TPS22904 g_iinleak_ta_lvs827.gifFigure 9. IIN (Leakage) vs Temperature (VIN = 3.3 V)
TPS22903 TPS22904 g_03_trtf_ta_lvs827.gifFigure 11. trise (TPS22903/4) / tfall (TPS22903) vs Temperature (VIN = 3.3 V)
TPS22903 TPS22904 g_tfall_temp_tps22904_lvs827.gifFigure 13. tfall (TPS22904) vs Temperature (VIN = 3.3 V)
TPS22903 TPS22904 g_tonresp01_lvs827.gifFigure 15. tON Response
TPS22903 TPS22904 g_tonresp03_lvs827.gifFigure 17. tON Response
TPS22903 TPS22904 g_03_toffresp01_lvs827.gifFigure 19. tOFF Response (TPS22903)
TPS22903 TPS22904 g_03_toffresp03_lvs827.gifFigure 21. tOFF Response (TPS22903)
TPS22903 TPS22904 g_toff_resp_0p1uf_100ma_1p2v_tps22904_lvs827.gifFigure 23. tOFF Response (TPS22904)
TPS22903 TPS22904 g_toff_resp_10uf_100ma_1p2v_tps22904_lvs827.gifFigure 25. tOFF Response (TPS22904)
TPS22903 TPS22904 g_ron_ta_lvs827.gifFigure 2. rON vs Temperature (VIN = 3.3 V)
TPS22903 TPS22904 g_quiescurrent_vin_lvs827.gifFigure 4. Quiescent Current vs VIN
(VON = VIN, IOUT = 0)
TPS22903 TPS22904 g_iinoff_vin_lvs827.gifFigure 6. IIN(OFF) vs VIN (VON = 0 V)
TPS22903 TPS22904 g_iinleak_vin_lvs827.gifFigure 8. IIN(Leakage) vs VIN (IOUT = 0)
TPS22903 TPS22904 g_onstatethres_lvs827.gifFigure 10. ON-Input Threshold
TPS22903 TPS22904 g_03_tontoff_ta_lvs827.gifFigure 12. tON (TPS22903/4) / tOFF (TPS22903) vs Temperature (VIN = 3.3 V)
TPS22903 TPS22904 g_toff_temp_tps22904_lvs827.gifFigure 14. tOFF (TPS22904) vs Temperature (VIN = 3.3 V)
TPS22903 TPS22904 g_tonresp02_lvs827.gifFigure 16. tON Response
TPS22903 TPS22904 g_tonresp04_lvs827.gifFigure 18. tON Response
TPS22903 TPS22904 g_03_toffresp02_lvs827.gifFigure 20. tOFF Response (TPS22903)
TPS22903 TPS22904 g_03_toffresp04_lvs827.gifFigure 22. tOFF Response (TPS22903)
TPS22903 TPS22904 g_toff_resp_0p1uf_100ma_3p3v_tps22904_lvs827.gifFigure 24. tOFF Response (TPS22904)
TPS22903 TPS22904 g_toff_resp_10uf_100ma_3p3v_tps22904_lvs827.gifFigure 26. tOFF Response (TPS22904)