SLVSBI7C July   2012  – April 2015 TPS22908

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
      1. 7.7.1 Typical DC Characteristics
      2. 7.7.2 Typical Switching Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 ON/OFF Control
      2. 9.3.2 Quick Output Discharge
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input Capacitor (Optional)
      2. 10.1.2 Output Capacitor (Optional)
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Managing Inrush Current
        2. 10.2.2.2 VIN to VOUT Voltage Drop
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT(2)
VIN Supply voltage –0.3 4 V
VOUT Output voltage –0.3 (VIN + 0.3) V
VON Input voltage –0.3 4 V
IMAX Maximum Continuous Switch Current for VIN ≥ 1.2 V 1 A
Maximum Continuous Switch Current at VIN = 1 V 0.6
TJ Maximum junction temperature(3) 125 °C
TLEAD Maximum lead temperature (10-s soldering time) 300 °C
TSTG Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA(max) = TJ(max) – (RθJA × PD(max))

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN MAX UNIT
VIN Input voltage 1 3.6 V
VON ON voltage 0 3.6 V
VOUT Output voltage 0 VIN V
VIH High-level input voltage, ON 0.85 3.6 V
VIL Low-level input voltage, ON 0 0.4 V
TA Operating free-air temperature range -40 85 °C
CIN Input capacitor 1(1) µF
(1) Refer to application section.

7.4 Thermal Information

THERMAL METRIC(1) TPS22908 UNIT
YZT (DSBGA)
4 PINS
RθJA Junction-to-ambient thermal resistance 188 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 2
RθJB Junction-to-board thermal resistance 33
ψJT Junction-to-top characterization parameter 9.1
ψJB Junction-to-board characterization parameter 33
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

Unless otherwise noted the specification applies over the operating ambient temp –40°C ≤ TA ≤ 85°C. Typical values are for VIN = 3.6 V, and TA = 25°C unless otherwise noted.
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
POWER SUPPLIES AND CURRENTS
IIN Quiescent current IOUT = 0 mA, VIN = VON Full 0.19 1 µA
IIN(OFF) OFF-state supply current VON = 0 V, VOUT = Open Full 0.12 1 µA
IIN(LEAK) OFF-state supply current VON = 0 V, VOUT = 0 V Full 0.12 1 µA
ION ON pin input leakage current VON = 1.1 V to 3.6 V Full 0.01 0.1 µA
RESISTANCE AND SWITCH CHARACTERISTICS
RON ON-state resistance IOUT = –200 mA VIN = 3.6 V 25°C 28.2 32.1 mΩ
Full 34.9
VIN = 2.5 V 25°C 33.1 37.5 mΩ
Full 40.6
VIN = 1.8 V 25°C 41.5 50.3 mΩ
Full 54.0
VIN = 1.2 V 25°C 69.7 87.3 mΩ
Full 91.2
VIN = 1.0 V 25°C 112 155 mΩ
Full 156
RPD Output pulldown resistance VIN = 3.3 V, VON = 0 V, IOUT = 30 mA 25°C 80 100 Ω

7.6 Switching Characteristics

PARAMETER TEST CONDITION TPS22908 UNIT
MIN TYP MAX
VIN = 3.6 V, TA = 25°C (unless otherwise noted)
tON Turn-ON time RL = 10 Ω, CL = 0.1 µF 110 µs
tOFF Turn-OFF time RL = 10 Ω, CL = 0.1 µF 5
tR VOUT Rise time RL = 10 Ω, CL = 0.1 µF 105
tF VOUT Fall time RL = 10 Ω, CL = 0.1 µF 2
VIN = 1.0 V, TA = 25°C (unless otherwise noted)
tON Turn-ON time RL = 10 Ω, CL = 0.1 µF 493 µs
tOFF Turn-OFF time RL = 10 Ω, CL = 0.1 µF 7
tR VOUT Rise time RL = 10 Ω, CL = 0.1 µF 442
tF VOUT Fall time RL = 10 Ω, CL = 0.1 µF 2

7.7 Typical Characteristics

7.7.1 Typical DC Characteristics

TPS22908 tc001_lvsbi7.pngFigure 1. VIN vs. Quiescent Current (IIN)
TPS22908 tc003_lvsbi7.pngFigure 3. VIN vs. IIN(OFF)
TPS22908 tc005_lvsbi7.pngFigure 5. VIN vs. RON
TPS22908 tc006_lvsbi7.pngFigure 7. IOUT vs. RPD
TPS22908 tc008_lvsbi7.pngFigure 9. VON Threshold vs. VOUT
(ON pin Voltage Decreasing)
TPS22908 tc002_lvsbi7.pngFigure 2. VIN vs. IIN(LEAK)
TPS22908 tc004_lvsbi7.pngFigure 4. Temperature vs. RON
TPS22908 tc005b_lvsbi7.pngFigure 6. RON vs. Load Current
(Various VIN at TA = 25°C)
TPS22908 tc007_lvsbi7.pngFigure 8. VIN vs. RPD
TPS22908 tc009_lvsbi7.pngFigure 10. VON Threshold vs. VOUT
(ON Pin Voltage Increasing)

7.7.2 Typical Switching Characteristics

TPS22908 tc010_lvsbi7.pngFigure 11. Rise Time vs. Temperature (VIN = 3.6 V)
TPS22908 tc012_lvsbi7.pngFigure 13. Fall Time vs. Temperature (VIN = 3.6 V)
TPS22908 tc014_lvsbi7.pngFigure 15. Turnon Time vs. Temperature (VIN = 3.6 V)
TPS22908 tc016_lvsbi7.pngFigure 17. Turnoff Time vs. Temperature (VIN = 3.6 V)
TPS22908 tc018_lvsbi7.pngFigure 19. Rise Time vs. VIN (CL = 0.1 µF)
TPS22908 sc001_lvsbi7.pngFigure 21. Turn on Response Time (VIN = 3.6 V, CIN = 10 µF, CL = 1 µF, RL = 10 Ω)
TPS22908 sc003_lvsbi7.pngFigure 23. Turn on Response Time (VIN = 3.6 V, CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω)
TPS22908 sc005_lvsbi7.pngFigure 25. Turn off Response Time (VIN = 3.6 V, CIN = 10 µF, CL = 1 µF, RL = 10 Ω)
TPS22908 sc007_lvsbi7.pngFigure 27. Turn off Response Time (VIN = 3.6 V, CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω)
TPS22908 tc011_lvsbi7.pngFigure 12. Rise Time vs. Temperature (VIN = 1 V)
TPS22908 tc013_lvsbi7.pngFigure 14. Fall Time vs. Temperature (VIN = 1 V)
TPS22908 tc015_lvsbi7.pngFigure 16. Turnon Time vs. Temperature (VIN = 1 V)
TPS22908 tc017_lvsbi7.pngFigure 18. Turnoff Time vs. Temperature (VIN = 1 V)
TPS22908 tc019_lvsbi7.pngFigure 20. Rise Time vs. VIN (CL = 1 µF)
TPS22908 sc002_lvsbi7.pngFigure 22. Turn on Response Time (VIN = 1 V, CIN = 10 µF, CL = 1 µF, RL = 10 Ω)
TPS22908 sc004_lvsbi7.pngFigure 24. Turn on Response Time (VIN = 1 V, CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω)
TPS22908 sc006_lvsbi7.pngFigure 26. Turn off Response Time (VIN = 1 V, CIN = 10 µF, CL = 1 µF, RL = 10 Ω)
TPS22908 sc008_lvsbi7.pngFigure 28. Turn off Response Time (VIN = 1 V, CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω)