SLVSAY8D June   2011  – January 2016 TPS22920

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics: VIN = 3.6 V
    7. 7.7  Switching Characteristics: VIN = 0.9 V
    8. 7.8  Typical DC Characteristics
    9. 7.9  TPS22920 Typical AC Characteristics
    10. 7.10 TPS22920L Typical AC Characteristics
  8. 8 Parametric Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 ON/OFF Control
      2. 9.3.2 Output Pull-Down
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input Capacitor
      2. 10.1.2 Output Capacitor
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 VIN to VOUT Voltage Drop
        2. 10.2.2.2 Managing Inrush Current
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison Table

ORDERABLE PART NUMBER RON (TYP)
AT 3.6 V		 RISE TIME
(TYP) at 3.6V		 QUICK OUTPUT DISCHARGE(1) BACKSIDE COATING(2) ENABLE
TPS22920YZPR 5.3 mΩ 880 µS Yes No Active High
TPS22920YZPRB 5.3 mΩ 880 µS Yes Yes Active High
TPS22920LYZPR 5.3 mΩ 627 µS Yes Yes Active Low
(1) This feature discharges the output of the switch to ground through a 1250-Ω resistor, preventing the output from floating. See Output Pull-Down.
(2) CSP (DSBGA) devices manufactured with backside coating have an increased resistance to cracking due to the increased physical strength of the package. Devices with backside coating are highly encouraged for new designs.