SLVSGG4B september   2022  – june 2023 TPS25990

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Logic Interface DC Characteristics
    7. 7.7  Telemetry
    8. 7.8  PMBus Interface Timing Characteristics
    9. 7.9  External EEPROM Interface Timing Characteristics
    10. 7.10 Timing Requirements
    11. 7.11 Switching Characteristics
    12. 7.12 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Undervoltage Protection
      2. 8.3.2  Insertion Delay
      3. 8.3.3  Overvoltage Protection
      4. 8.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 8.3.4.1 Slew rate (dVdt) and Inrush Current Control
          1. 8.3.4.1.1 Start-Up Timeout
        2. 8.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 8.3.4.3 Active Current Limiting During Start-Up
        4. 8.3.4.4 Short-Circuit Protection
      5. 8.3.5  Single Point Failure Mitigation
        1. 8.3.5.1 IMON Pin Single Point Failure
        2. 8.3.5.2 ILIM Pin Single Point Failure
        3. 8.3.5.3 IREF Pin Single Point Failure
      6. 8.3.6  Analog Load Current Monitor (IMON)
      7. 8.3.7  Overtemperature Protection
      8. 8.3.8  Analog Junction Temperature Monitor (TEMP)
      9. 8.3.9  FET Health Monitoring
      10. 8.3.10 General Purpose Digital Input/Output Pins
        1. 8.3.10.1 Fault Response and Indication (FLT)
        2. 8.3.10.2 Power Good Indication (PG)
        3. 8.3.10.3 Parallel Device Synchronization (SWEN)
      11. 8.3.11 Stacking Multiple eFuses for Unlimited Scalability
        1. 8.3.11.1 Current Balancing During Start-Up
      12. 8.3.12 General Purpose Comparators
      13. 8.3.13 Output Discharge
      14. 8.3.14 PMBus® Digital Interface
        1. 8.3.14.1  PMBus® Device Addressing
        2. 8.3.14.2  SMBus Protocol
        3. 8.3.14.3  SMBus™ Message Formats
        4. 8.3.14.4  Packet Error Checking
        5. 8.3.14.5  Group Commands
        6. 8.3.14.6  SMBus™ Alert Response Address (ARA)
        7. 8.3.14.7  PMBus® Commands
          1. 8.3.14.7.1 Detailed Descriptions of PMBus® Commands
            1. 8.3.14.7.1.1  OPERATION (01h, Read/Write Byte)
            2. 8.3.14.7.1.2  CLEAR_FAULTS (03h, Send Byte)
            3. 8.3.14.7.1.3  RESTORE_FACTORY_DEFAULTS (12h, Send Byte)
            4. 8.3.14.7.1.4  STORE_USER_ALL (15h, Send Byte)
            5. 8.3.14.7.1.5  RESTORE_USER_ALL (16h, Send Byte)
            6. 8.3.14.7.1.6  BB_ERASE (F5h, Send Byte)
            7. 8.3.14.7.1.7  FETCH_BB_EEPROM (F6h, Send Byte)
            8. 8.3.14.7.1.8  POWER_CYCLE (D9h, Send Byte)
            9. 8.3.14.7.1.9  MFR_WRITE_PROTECT (F8h, Read/Write Byte)
            10. 8.3.14.7.1.10 CAPABILITY (19h, Read Byte)
            11. 8.3.14.7.1.11 STATUS_BYTE (78h, Read Byte)
            12. 8.3.14.7.1.12 STATUS_WORD (79h, Read Word)
            13. 8.3.14.7.1.13 STATUS_OUT (7Ah, Read Byte)
            14. 8.3.14.7.1.14 STATUS_IOUT (7Bh, Read Byte)
            15. 8.3.14.7.1.15 STATUS_INPUT (7Ch, Read Byte)
            16. 8.3.14.7.1.16 STATUS_TEMP (7Dh, Read Byte)
            17. 8.3.14.7.1.17 STATUS_CML (7Eh, Read Byte)
            18. 8.3.14.7.1.18 STATUS_MFR_SPECIFIC (80h, Read Byte)
            19. 8.3.14.7.1.19 STATUS_MFR_SPECIFIC_2 (F3h, Read Word)
            20. 8.3.14.7.1.20 PMBUS_REVISION (98h, Read Byte)
            21. 8.3.14.7.1.21 MFR_ID (99h, Block Read)
            22. 8.3.14.7.1.22 MFR_MODEL (9Ah, Block Read)
            23. 8.3.14.7.1.23 MFR_REVISION (9Bh, Block Read)
            24. 8.3.14.7.1.24 READ_VIN (88h, Read Word)
            25. 8.3.14.7.1.25 READ_VOUT (8Bh, Read Word)
            26. 8.3.14.7.1.26 READ_IIN (89h, Read Word)
            27. 8.3.14.7.1.27 READ_TEMPERATURE_1 (8Dh, Read Word)
            28. 8.3.14.7.1.28 READ_VAUX (D0h, Read Word)
            29. 8.3.14.7.1.29 READ_PIN (97h, Read Word)
            30. 8.3.14.7.1.30 READ_EIN (86h, Block Read)
            31. 8.3.14.7.1.31 READ_VIN_AVG (DCh, Read Word)
            32. 8.3.14.7.1.32 READ_VIN_MIN (D1h, Read Word)
            33. 8.3.14.7.1.33 READ_VIN_PEAK (D2h, Read Word)
            34. 8.3.14.7.1.34 READ_VOUT_AVG (DDh, Read Word)
            35. 8.3.14.7.1.35 READ_VOUT_MIN (DAh, Read Word)
            36. 8.3.14.7.1.36 READ_IIN_AVG (DEh, Read Word)
            37. 8.3.14.7.1.37 READ_IIN_PEAK (D4h, Read Word)
            38. 8.3.14.7.1.38 READ_TEMP_AVG (D6h, Read Word)
            39. 8.3.14.7.1.39 READ_TEMP_PEAK (D7h, Read Word)
            40. 8.3.14.7.1.40 READ_PIN_AVG (DFh, Read Word)
            41. 8.3.14.7.1.41 READ_PIN_PEAK (D5h, Read Word)
            42. 8.3.14.7.1.42 READ_SAMPLE_BUF (D8h, Block Read)
            43. 8.3.14.7.1.43 READ_BB_RAM (FDh, Block Read)
            44. 8.3.14.7.1.44 READ_BB_EEPROM (F4h, Block Read)
            45. 8.3.14.7.1.45 BB_TIMER (FAh, Read Byte)
            46. 8.3.14.7.1.46 PMBUS_ADDR (FBh, Read/Write Byte)
            47. 8.3.14.7.1.47 VIN_UV_WARN (58h, Read/Write Word)
            48. 8.3.14.7.1.48 VIN_UV_FLT (59h, Read/Write Word)
            49. 8.3.14.7.1.49 VIN_OV_WARN (57h, Read/Write Word)
            50. 8.3.14.7.1.50 VIN_OV_FLT (55h, Read/Write Word)
            51. 8.3.14.7.1.51 VOUT_UV_WARN (43h, Read/Write Word)
            52. 8.3.14.7.1.52 VOUT_PGTH (5Fh, Read/Write Word)
            53. 8.3.14.7.1.53 OT_WARN (51h, Read/Write Word)
            54. 8.3.14.7.1.54 OT_FLT (4Fh, Read/Write Word)
            55. 8.3.14.7.1.55 PIN_OP_WARN (6Bh, Read/Write Word)
            56. 8.3.14.7.1.56 IIN_OC_WARN (5Dh, Read/Write Word)
            57. 8.3.14.7.1.57 VIREF (E0h, Read/Write Byte)
            58. 8.3.14.7.1.58 GPIO_CONFIG_12 (E1h, Read/Write Byte)
            59. 8.3.14.7.1.59 GPIO_CONFIG_34 (E2h, Read/Write Byte)
            60. 8.3.14.7.1.60 ALERT_MASK (DBh, Read/Write Word)
            61. 8.3.14.7.1.61 FAULT_MASK (E3h, Read/Write Word)
            62. 8.3.14.7.1.62 DEVICE_CONFIG (E4h, Read/Write Word)
            63. 8.3.14.7.1.63 BB_CONFIG (E5h, Read/Write Byte)
            64. 8.3.14.7.1.64 OC_TIMER (E6h, Read/Write Byte)
            65. 8.3.14.7.1.65 RETRY_CONFIG (E7h, Read/Write Byte)
            66. 8.3.14.7.1.66 ADC_CONFIG_1 (E8h, Read/Write Byte)
            67. 8.3.14.7.1.67 ADC_CONFIG_2 (E9h, Read/Write Byte)
            68. 8.3.14.7.1.68 PK_MIN_AVG (EAh, Read/Write Byte)
            69. 8.3.14.7.1.69 VCMPxREF (EBh, Read/Write Byte)
            70. 8.3.14.7.1.70 PSU_VOLTAGE (ECh, Read/Write Byte)
            71. 8.3.14.7.1.71 CABLE_DROP (EDh, Read/Write Byte)
            72. 8.3.14.7.1.72 GPDAC1 (F0h, Read/Write Byte)
            73. 8.3.14.7.1.73 GPDAC2 (F1h, Read/Write Byte)
            74. 8.3.14.7.1.74 INS_DLY (F9h, Read/Write Byte)
        8. 8.3.14.8  Analog-to-digital Converter
        9. 8.3.14.9  Digital-to-analog Converters
        10. 8.3.14.10 DIRECT format Conversion
        11. 8.3.14.11 Blackbox Fault Recording
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Single Device, Standalone Operation
      2. 9.1.2 Multiple Devices, Parallel Connection
      3. 9.1.3 Multiple Devices, Independent Operation (Multi-zone)
    2. 9.2 Typical Application: 12-V, 4-kW Power Path Protection with PMBus® Interface in Datacenter Servers
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Transient Protection
      2. 9.4.2 Output Short-Circuit Measurements
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.3 Application Performance Plots

All the waveforms below are captured on an evaluation setup with one (1) TPS25990 eFuse and five (5) TPS25985x eFuses in parallel. All the pullup supplies are derived from a separate standby rail.

GUID-20220905-SS0I-SX1N-HBLZ-TP25FJPGTHNT-low.svgFigure 9-5 Input Hot Plug: VIN Stepped Up from 0 V to 12 V, CLOAD = 50 mF, RLOAD(Start-up) = 0.48 Ω, CDVDT = 33 nF, VIREF = 1 V, RILIM(TPS25990) = 422 Ω, and RILIM(TPS25985) = 316 Ω
GUID-20220905-SS0I-NQHB-V1R8-X1GDMNMTVCWM-low.svgFigure 9-7 Power Up into Short: VIN = 12 V, EN/UVLO Stepped Up From 0 V to 3 V, VIREF = 1 V, RILIM(TPS25990) = 422 Ω, RILIM(TPS25985) = 316 Ω, and OUT Shorted to GND
GUID-20220905-SS0I-NMDK-KBDZ-BTRBLTLVRDMZ-low.svgFigure 9-9 Transient Overload: VIN = 12 V, tOC_TIMER = 10 ms, CLOAD = 50 mF, RIMON = 150 Ω, VIREF = 1 V, and Load Current Stepped from 333 A to 500 A then 333 A within 8.5 ms
GUID-20220905-SS0I-L3FV-2DGG-KK4RRXK71CWX-low.svgFigure 9-11 Circuit-Breaker Response: VIN = 12 V, tOC_TIMER = 10 ms, CLOAD = 50 mF, RIMON = 150 Ω, VIREF = 1 V, and Load Current Stepped from 333 A to 530 A for more than 10 ms
GUID-20230531-SS0I-QKMP-RJJN-MFTVQDJBMZPD-low.svgFigure 9-13 Output Hot-Short Response: VIN = 12 V, RIMON = 150 Ω, VIREF = 1 V, and OUT Shorted to GND
GUID-20220905-SS0I-Z5QC-P1VK-NVM0979Q0VPZ-low.svgFigure 9-6 Start-up with EN/UVLO: VIN = 12 V, EN/UVLO Stepped Up From 0 V to 3 V, CLOAD = 50 mF, RLOAD(Start-up) = 0.48 Ω, CDVDT = 33 nF, VIREF = 1 V, RILIM(TPS25990) = 422 Ω, and RILIM(TPS25985) = 316 Ω
GUID-20220905-SS0I-1CSK-LKBV-JNPVSLP7XJ16-low.svgFigure 9-8 Power Up into Short (Current distribution among six devices in parallel): VIN = 12 V, EN/UVLO Stepped Up From 0 V to 3 V, VIREF = 1 V, RILIM(TPS25990) = 422 Ω, RILIM(TPS25985) = 316 Ω, and OUT Shorted to GND
GUID-20220905-SS0I-CDR1-BN3J-5WK2SMZXHX9D-low.svgFigure 9-10 Transient Overload (Current distribution among six devices in parallel): VIN = 12 V, tOC_TIMER = 10 ms, CLOAD = 50 mF, RIMON = 150 Ω, VIREF = 1 V, and Load Current Stepped from 333 A to 500 A then 333 A within 8.5 ms
GUID-20220905-SS0I-F0MW-W0Q9-Z2N7XLXGBBWK-low.svgFigure 9-12 Circuit-Breaker Response (Current distribution among six devices in parallel): VIN = 12 V, tOC_TIMER = 17 ms, CLOAD = 50 mF, RIMON = 150 Ω, VIREF = 1 V, and Load Current Stepped from 333 A to 530 A for more than 17 ms
GUID-20230601-SS0I-HFGF-7B2G-N6TPBD6HHWBL-low.svgFigure 9-14 One (1) TPS25990 eFuse and one (1) TPS25985x eFuse in Parallel: Temperature Rise with 110-A DC Current at Room Temperature (No Air-Flow)