SLVSGG4B september   2022  – june 2023 TPS25990

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Logic Interface DC Characteristics
    7. 7.7  Telemetry
    8. 7.8  PMBus Interface Timing Characteristics
    9. 7.9  External EEPROM Interface Timing Characteristics
    10. 7.10 Timing Requirements
    11. 7.11 Switching Characteristics
    12. 7.12 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Undervoltage Protection
      2. 8.3.2  Insertion Delay
      3. 8.3.3  Overvoltage Protection
      4. 8.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 8.3.4.1 Slew rate (dVdt) and Inrush Current Control
          1. 8.3.4.1.1 Start-Up Timeout
        2. 8.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 8.3.4.3 Active Current Limiting During Start-Up
        4. 8.3.4.4 Short-Circuit Protection
      5. 8.3.5  Single Point Failure Mitigation
        1. 8.3.5.1 IMON Pin Single Point Failure
        2. 8.3.5.2 ILIM Pin Single Point Failure
        3. 8.3.5.3 IREF Pin Single Point Failure
      6. 8.3.6  Analog Load Current Monitor (IMON)
      7. 8.3.7  Overtemperature Protection
      8. 8.3.8  Analog Junction Temperature Monitor (TEMP)
      9. 8.3.9  FET Health Monitoring
      10. 8.3.10 General Purpose Digital Input/Output Pins
        1. 8.3.10.1 Fault Response and Indication (FLT)
        2. 8.3.10.2 Power Good Indication (PG)
        3. 8.3.10.3 Parallel Device Synchronization (SWEN)
      11. 8.3.11 Stacking Multiple eFuses for Unlimited Scalability
        1. 8.3.11.1 Current Balancing During Start-Up
      12. 8.3.12 General Purpose Comparators
      13. 8.3.13 Output Discharge
      14. 8.3.14 PMBus® Digital Interface
        1. 8.3.14.1  PMBus® Device Addressing
        2. 8.3.14.2  SMBus Protocol
        3. 8.3.14.3  SMBus™ Message Formats
        4. 8.3.14.4  Packet Error Checking
        5. 8.3.14.5  Group Commands
        6. 8.3.14.6  SMBus™ Alert Response Address (ARA)
        7. 8.3.14.7  PMBus® Commands
          1. 8.3.14.7.1 Detailed Descriptions of PMBus® Commands
            1. 8.3.14.7.1.1  OPERATION (01h, Read/Write Byte)
            2. 8.3.14.7.1.2  CLEAR_FAULTS (03h, Send Byte)
            3. 8.3.14.7.1.3  RESTORE_FACTORY_DEFAULTS (12h, Send Byte)
            4. 8.3.14.7.1.4  STORE_USER_ALL (15h, Send Byte)
            5. 8.3.14.7.1.5  RESTORE_USER_ALL (16h, Send Byte)
            6. 8.3.14.7.1.6  BB_ERASE (F5h, Send Byte)
            7. 8.3.14.7.1.7  FETCH_BB_EEPROM (F6h, Send Byte)
            8. 8.3.14.7.1.8  POWER_CYCLE (D9h, Send Byte)
            9. 8.3.14.7.1.9  MFR_WRITE_PROTECT (F8h, Read/Write Byte)
            10. 8.3.14.7.1.10 CAPABILITY (19h, Read Byte)
            11. 8.3.14.7.1.11 STATUS_BYTE (78h, Read Byte)
            12. 8.3.14.7.1.12 STATUS_WORD (79h, Read Word)
            13. 8.3.14.7.1.13 STATUS_OUT (7Ah, Read Byte)
            14. 8.3.14.7.1.14 STATUS_IOUT (7Bh, Read Byte)
            15. 8.3.14.7.1.15 STATUS_INPUT (7Ch, Read Byte)
            16. 8.3.14.7.1.16 STATUS_TEMP (7Dh, Read Byte)
            17. 8.3.14.7.1.17 STATUS_CML (7Eh, Read Byte)
            18. 8.3.14.7.1.18 STATUS_MFR_SPECIFIC (80h, Read Byte)
            19. 8.3.14.7.1.19 STATUS_MFR_SPECIFIC_2 (F3h, Read Word)
            20. 8.3.14.7.1.20 PMBUS_REVISION (98h, Read Byte)
            21. 8.3.14.7.1.21 MFR_ID (99h, Block Read)
            22. 8.3.14.7.1.22 MFR_MODEL (9Ah, Block Read)
            23. 8.3.14.7.1.23 MFR_REVISION (9Bh, Block Read)
            24. 8.3.14.7.1.24 READ_VIN (88h, Read Word)
            25. 8.3.14.7.1.25 READ_VOUT (8Bh, Read Word)
            26. 8.3.14.7.1.26 READ_IIN (89h, Read Word)
            27. 8.3.14.7.1.27 READ_TEMPERATURE_1 (8Dh, Read Word)
            28. 8.3.14.7.1.28 READ_VAUX (D0h, Read Word)
            29. 8.3.14.7.1.29 READ_PIN (97h, Read Word)
            30. 8.3.14.7.1.30 READ_EIN (86h, Block Read)
            31. 8.3.14.7.1.31 READ_VIN_AVG (DCh, Read Word)
            32. 8.3.14.7.1.32 READ_VIN_MIN (D1h, Read Word)
            33. 8.3.14.7.1.33 READ_VIN_PEAK (D2h, Read Word)
            34. 8.3.14.7.1.34 READ_VOUT_AVG (DDh, Read Word)
            35. 8.3.14.7.1.35 READ_VOUT_MIN (DAh, Read Word)
            36. 8.3.14.7.1.36 READ_IIN_AVG (DEh, Read Word)
            37. 8.3.14.7.1.37 READ_IIN_PEAK (D4h, Read Word)
            38. 8.3.14.7.1.38 READ_TEMP_AVG (D6h, Read Word)
            39. 8.3.14.7.1.39 READ_TEMP_PEAK (D7h, Read Word)
            40. 8.3.14.7.1.40 READ_PIN_AVG (DFh, Read Word)
            41. 8.3.14.7.1.41 READ_PIN_PEAK (D5h, Read Word)
            42. 8.3.14.7.1.42 READ_SAMPLE_BUF (D8h, Block Read)
            43. 8.3.14.7.1.43 READ_BB_RAM (FDh, Block Read)
            44. 8.3.14.7.1.44 READ_BB_EEPROM (F4h, Block Read)
            45. 8.3.14.7.1.45 BB_TIMER (FAh, Read Byte)
            46. 8.3.14.7.1.46 PMBUS_ADDR (FBh, Read/Write Byte)
            47. 8.3.14.7.1.47 VIN_UV_WARN (58h, Read/Write Word)
            48. 8.3.14.7.1.48 VIN_UV_FLT (59h, Read/Write Word)
            49. 8.3.14.7.1.49 VIN_OV_WARN (57h, Read/Write Word)
            50. 8.3.14.7.1.50 VIN_OV_FLT (55h, Read/Write Word)
            51. 8.3.14.7.1.51 VOUT_UV_WARN (43h, Read/Write Word)
            52. 8.3.14.7.1.52 VOUT_PGTH (5Fh, Read/Write Word)
            53. 8.3.14.7.1.53 OT_WARN (51h, Read/Write Word)
            54. 8.3.14.7.1.54 OT_FLT (4Fh, Read/Write Word)
            55. 8.3.14.7.1.55 PIN_OP_WARN (6Bh, Read/Write Word)
            56. 8.3.14.7.1.56 IIN_OC_WARN (5Dh, Read/Write Word)
            57. 8.3.14.7.1.57 VIREF (E0h, Read/Write Byte)
            58. 8.3.14.7.1.58 GPIO_CONFIG_12 (E1h, Read/Write Byte)
            59. 8.3.14.7.1.59 GPIO_CONFIG_34 (E2h, Read/Write Byte)
            60. 8.3.14.7.1.60 ALERT_MASK (DBh, Read/Write Word)
            61. 8.3.14.7.1.61 FAULT_MASK (E3h, Read/Write Word)
            62. 8.3.14.7.1.62 DEVICE_CONFIG (E4h, Read/Write Word)
            63. 8.3.14.7.1.63 BB_CONFIG (E5h, Read/Write Byte)
            64. 8.3.14.7.1.64 OC_TIMER (E6h, Read/Write Byte)
            65. 8.3.14.7.1.65 RETRY_CONFIG (E7h, Read/Write Byte)
            66. 8.3.14.7.1.66 ADC_CONFIG_1 (E8h, Read/Write Byte)
            67. 8.3.14.7.1.67 ADC_CONFIG_2 (E9h, Read/Write Byte)
            68. 8.3.14.7.1.68 PK_MIN_AVG (EAh, Read/Write Byte)
            69. 8.3.14.7.1.69 VCMPxREF (EBh, Read/Write Byte)
            70. 8.3.14.7.1.70 PSU_VOLTAGE (ECh, Read/Write Byte)
            71. 8.3.14.7.1.71 CABLE_DROP (EDh, Read/Write Byte)
            72. 8.3.14.7.1.72 GPDAC1 (F0h, Read/Write Byte)
            73. 8.3.14.7.1.73 GPDAC2 (F1h, Read/Write Byte)
            74. 8.3.14.7.1.74 INS_DLY (F9h, Read/Write Byte)
        8. 8.3.14.8  Analog-to-digital Converter
        9. 8.3.14.9  Digital-to-analog Converters
        10. 8.3.14.10 DIRECT format Conversion
        11. 8.3.14.11 Blackbox Fault Recording
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Single Device, Standalone Operation
      2. 9.1.2 Multiple Devices, Parallel Connection
      3. 9.1.3 Multiple Devices, Independent Operation (Multi-zone)
    2. 9.2 Typical Application: 12-V, 4-kW Power Path Protection with PMBus® Interface in Datacenter Servers
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Transient Protection
      2. 9.4.2 Output Short-Circuit Measurements
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

(Test conditions unless otherwise noted) –40°C ≤ TJ ≤ 125°C, VIN = 12 V, VDD = 12 V, OUT = Open, VEN/UVLO = 2 V, SWEN = 10 kΩ pull-up to 5 V, RILIM = 550 Ω, RIMON = 1.1 kΩ, DVDT = Open, FLT = 10 kΩ pull-up to 5 V, PG = 10 kΩ pull-up to 5 V, TEMP = Open, ADDR0 = Open, ADDR1 = Open, SCL, SDA and SMBA# pulled up to 3.3 V. All voltages referenced to GND. 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT SUPPLY (VDD)
VDD VDD input operating voltage range 4.5 16 V
IQON(VDD) VDD ON state quiescent current VVDD > VUVP(R), VEN ≥ VUVLO(R) 3.7 5.5 mA
IQOFF(VDD) VDD OFF state current  VSD(R) < VEN < VUVLO(F) 3.7 5.5 mA
ISD(VDD) VDD shutdown current VEN < VSD(F) 4 6 mA
VUVP(R) VDD undervoltage protection threshold VDD Rising 4 4.26 4.5 V
VUVP(F) VDD undervoltage protection threshold VDD Falling 3.9 4.07 4.4 V
INPUT SUPPLY (IN)
VIN VIN input operating voltage range 2.9 16 V
VUVPIN(R) VIN undervoltage protection threshold 2.71 2.81 2.91 V
VUVPIN(F) VIN undervoltage protection threshold 2.59 2.59 2.60 V
VUVLOIN(R) VIN undervoltage protection threshold VIN Rising, VIN_UV_FLT = 0x8D (Default register value) 10.82 11.02 11.17 V
VUVLOIN(F) VIN undervoltage protection threshold VIN Falling, VIN_UV_FLT = 0x8D (Default register value) 10.52 10.78 10.97 V
IQON(IN) IN ON state quiescent current VEN ≥ VUVLO(R) 2.6 3.5 mA
IQOFF(IN) IN OFF state current   VSD(R) < VEN < VUVLO(F) 2.6 3.5 mA
ISD(IN) IN shutdown current VEN < VSD(F) 2.7 3.5 mA
ENABLE / UNDERVOLTAGE LOCKOUT (EN/UVLO)
VUVLO(R) EN/UVLO pin voltage threshold for turning on, rising EN/UVLO  Rising 1.12 1.2 1.28 V
VUVLO(F) EN/UVLO pin voltage threshold for turning off and engaging QOD, falling EN/UVLO Falling 1.02 1.1 1.18 V
VSD(F) Shutdown threshold EN/UVLO Falling 0.6 V
IENLKG EN/UVLO pin leakage current VEN < Min(VIN + 1 V, VDD + 1 V) 0.1 µA
OVERVOLTAGE PROTECTION (IN)
VOVP(R) VIN overvoltage protection threshold (rising) VIN_OV_FLT = 0x0E (Default setting), VIN rising 16.39 16.73 17.08 V
VOVP(F) VIN overvoltage protection threshold (rising) VIN_OV_FLT = 0x0E (Default setting), VIN falling 16.1 16.48 16.8 V
VOVP(R) VIN overvoltage protection threshold (rising) VIN_OV_FLT = 0x0B, VIN rising 13.32 13.74 14.15 V
VOVP(F) VIN overvoltage protection threshold (falling) VIN_OV_FAULT = 0x0B, VIN falling 13.1 13.49 13.89 V
VOVP(R) VIN overvoltage protection threshold (falling) VIN_OV_FAULT = 0x01, VIN rising 3.77 3.94 4.15
VOVP(F) VIN overvoltage protection threshold (falling) VIN_OV_FAULT = 0x01. VIN falling 3.53 3.69 3.86
ON-RESISTANCE (IN - OUT)
RON ON resistance TJ = 25 ℃ 0.79 1.05 mΩ
RON ON resistance TJ = –40 to 125 ℃ 1.4 mΩ
OUTPUT CURRENT MONITOR AND OVERCURRENT PROTECTION (IMON)
GIMON Current Monitor Gain (IMON:IOUT) Device in steady state (PG asserted) 17.87 18.18 18.55 µA/A
ILKG(IMON) IMON pin leakage/offset current 1.1 uA
IOCP Steady-state overcurrent protection (Circuit-Breaker) threshold RIMON = 1.1 kΩ, VIREF = 1 V 48.3 50 51.7 A
RIMON = 1.1 kΩ, VIREF = 0.5 V 24 25 26 A
RIMON = 1.1 kΩ, VIREF = 0.3 V 14.4 15 15.6 A
RIMON = 7.87 kΩ, VIREF = 0.1 V 6.72 7 7.28 A
CURRENT LIMIT (ILIM)
GILIM(LIN) Current Monitor Gain (ILIM:IOUT) vs. IOUT. Device in steady state (PG asserted) 17.87 18.18 18.55 µA/A
CLREF(SAT) Ratio of start-up current limit reference to steady-state circuit-breaker reference threshold VOUT > VFB, PG not asserted 23.33 %
ILIM Start-up current limit regulation threshold  RILIM = 314 Ω, VIREF = 1.182 V, VOUT > VFB 28 35 43.5 A
RILIM = 1.1 kΩ, VIREF = 1.182 V, VOUT > VFB 9.8 14 18.2 A
RILIM = 1.54 kΩ, VIREF = 1.182 V, VOUT > VFB 7 10 13 A
VFB Foldback voltage 1.5 2.0 2.5 V
CURRENT LIMIT REFERENCE (IREF/DAC2)
VIREF Current Limit Reference DAC output voltage VIREF = 0x32 (Default), DEVICE_CONFIG[6] = 0 0.99 1.0 1.01 V
VIREF = 0x00, DEVICE_CONFIG[6] = 0 0.29 0.3 0.31 V
VIREF = 0x3F, DEVICE_CONFIG[6] = 0 1.17 1.182 1.19 V
DAC2 OUTPUT (IREF/DAC2)
VDAC2 General purpose DAC 2 output voltage GPDAC2 = 0x00, DEVICE_CONFIG[6] = 1 291 300 308 mV
GPDAC2 = 0x1F, DEVICE_CONFIG[6] = 1 725 733 742 mV
GPDAC2 = 0x3F, DEVICE_CONFIG[6] = 1 1174 1180 1189 mV
DAC1 OUTPUT
IDAC1 General purpose DAC 1 sink current GPDAC1[6:0] = 0000000b 5.66 5.98 6.28 µA
GPDAC1[6:0] = 0011111b 27.72 29.21 30.57 µA
GPDAC1[6:0] = 0111111b 50.52 53.19 55.56 µA
GPDAC1[6:0] = 1xxxxxxb 0.05 µA
SHORT-CIRCUIT PROTECTION
IFFT Fixed fast-trip threshold PG asserted High  90 113.2 158.8 A
SFTREF(LIN) Scalable fast-trip threshold (IMON) to overcurrent protection threshold reference (IREF) ratio during steady-state DEVICE_CONFIG[12:11] = 11 225 %
DEVICE_CONFIG[12:11] = 10 200 %
DEVICE_CONFIG[12:11] = 01 175 %
DEVICE_CONFIG[12:11] = 00 150 %
SFTREF(SAT) Scalable fast-trip threshold (ILIM) to overcurrent protection threshold reference (IREF) ratio during inrush 50 %
ACTIVE CURRENT SHARING
RON(ACS) Maximum RON during steady-state active current sharing VILIM > CLREF(ACS)% × VIREF 1 1.81 mΩ
GIMON(ACS) IMON:IOUT ratio during active current sharing PG asserted High,  VILIM > CLREF(ACS)% × VIREF 18.0 18.36 18.77 µA/A
CLREF(ACS) Ratio of active current sharing trigger threshold to steady state overcurrent protection threshold PG asserted High 36.67 %
INRUSH CURRENT PROTECTION (DVDT)
IDVDT dVdt pin charging current DEVICE_CONFIG[10:9] = 11 2.38 3 4 µA
DEVICE_CONFIG[10:9] = 10 1.4 2 2.9 µA
DEVICE_CONFIG[10:9] = 01 1 1.5 2 µA
DEVICE_CONFIG[10:9] = 00 0.79 1 1.33 µA
GDVDT dVdt gain 20.7 V/V
RDVDT dVdt pin to GND discharge resistance 510 Ω
GHI
RON(GHI) RON when PG is asserted 1 1.81 mΩ
QUICK OUTPUT DISCHARGE (QOD)
IQOD Quick output discharge internal pull-down current on OUT VSD(F) < VEN < VUVLO(F) 10.8 22.1 38 mA
OVERTEMPERATURE PROTECTION (OTP)
TSD Thermal shutdown threshold TJ Rising 149 °C
TSDHYS Thermal shutdown hysteresis TJ Falling 11 °C
TEMPERATURE SENSOR OUTPUT (TEMP/CMP)
GTMP TEMP sensor gain 2.58 2.65 2.72 mV/℃
VTMP TEMP pin output voltage TJ = 25 ℃ 672 678 685 mV
ITMPSRC TEMP pin sourcing current 75 93.4 115.6 µA
ITMPSNK TEMP pin sinking current 7.6 10 14 µA
COMPARATORS (TEMP/CMP, AUX)
ICMPLKG TEMP/CMP input leakage current 0 ≤ VTEMP/CMP ≤ 1.2 V, TEMP/CMP pin configured as comparator 1 input 1 µA
IAUXLKG AUX input leakage current 0 ≤ VAUX ≤ 1.2 V 1 µA
VCMP1REF Comparator 1 reference voltage VCMPXREF[3:0] = 0000 176 199.5 224 mV
VCMPXREF[3:0] = 0011 476 501.8 524 mV
VCMPXREF[3:0] = 0111 876 900.4 923 mV
VCMPXREF[3:0] = 1111 1676 1700.4 1722 mV
VCMP2REF Comparator 2 reference voltage VCMPXREF[7:4] = 0000 176 199.4 224 mV
VCMPXREF[7:4] = 0011 476 500.1 524 mV
VCMPXREF[7:4] = 0111 876 899.7 923 mV
VCMPXREF[7:4] = 1111 1677 1699.2 1722 mV
FET HEALTH MONITOR
VDSFLT FET D-S Fault Threshold SWEN = L 0.35 0.49 0.59 V
ADDRESS SELECT (ADDR0/1)
IADDR ADDR0 pin pull-up current 3.85 5.05 6.25 µA
ADDR1 pin pull-up current 3.85 5.05 6.25 µA
SINGLE POINT FAILURE (ILIM, IMON, IREF)
IOC_BKP(LIN) Back-up overcurrent protection threshold (steady -state) 65 90 131 A
IOC_BKP(SAT) Back-up overcurrent protection threshold (start-up) 55 90 112 A