SLUS710E May   2006  – January 2024 TPS28225

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout (UVLO)
      2. 6.3.2 Output Active Low
      3. 6.3.3 Enable/Power Good
      4. 6.3.4 3-State Input
        1. 6.3.4.1 TPS28225 3-State Exit Mode
        2. 6.3.4.2 External Resistor Interference
      5. 6.3.5 Bootstrap Diode
      6. 6.3.6 Upper and Lower Gate Drivers
      7. 6.3.7 Dead-Time Control
      8. 6.3.8 Thermal Shutdown
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Four Phases Driven by TPS28225 Driver
        2. 7.2.2.2 Switching The MOSFETs
        3. 7.2.2.3 List of Materials
      3. 7.2.3 Application Curves
    3. 7.3 System Examples
  9. Power Supply Recommendations
  10. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Switching The MOSFETs

Driving the MOSFETs efficiently at high switching frequencies requires special attention to layout and the reduction of parasitic inductances. Efforts need to be done both at the driver’s die and package level and at the PCB layout level to keep the parasitic inductances as low as possible. Figure 7-4 shows the main parasitic inductances and current flow during turning ON and OFF of the MOSFET by charging its CGS gate capacitance.

GUID-4BA8A352-E58D-410F-8AC1-B345407C7DD2-low.gifFigure 7-4 MOSFET Drive Paths and Main Circuit Parasitics

The ISOURCE current charges the gate capacitor and the ISINK current discharges it. The rise and fall time of voltage across the gate defines how quickly the MOSFET can be switched. The timing parameters specified in datasheet for both upper and lower driver are shown in Figure 5-16 and Figure 5-17 where 3-nF load capacitor has been used for the characterization data. Based on these actual measurements, the analytical curves in Figure 7-5 and Figure 7-6 show the output voltage and current of upper and low side drivers during the discharging of load capacitor. The left waveforms show the voltage and current as a function of time, while the right waveforms show the relation between the voltage and current during fast switching. These waveforms show the actual switching process and its limitations because of parasitic inductances. The static VOUT/ IOUT curves shown in many datasheets and specifications for the MOSFET drivers do not replicate actual switching condition and provide limited information for the user.

Turning Off of the MOSFET needs to be done as fast as possible to reduce switching losses. For this reason the TPS28225 driver has very low output impedance specified as 0.4 Ω typical for lower driver and 1 Ω typical for upper driver at DC current. Assuming 8-V drive voltage and no parasitic inductances, one can expect an initial sink current amplitude of 20 A and 8 A respectively for the lower and upper drivers. With pure R-C discharge circuit for the gate capacitor, the voltage and current waveforms are expected to be exponential. However, because of parasitic inductances, the actual waveforms have some ringing and the peak current for the lower driver is about 4 A and about 2.5 A for the upper driver (Figure 7-5 and Figure 7-6). The overall parasitic inductance for the lower drive path is estimated as 4 nH and for the upper drive path as 6 nH. The internal parasitic inductance of the driver, which includes inductances of bonded wires and package leads, can be estimated for SOIC-8 package as 2 nH for lower gate and 4 nH for the upper gate. Use of DFN-8 package reduces the internal parasitic inductances by approximately 50%.

GUID-BA0209C7-BFA3-477A-B497-B28C66452C26-low.gifFigure 7-5 LGATE Turning Off Voltage and Sink Current vs Time (Related Switching Diagram (right))
GUID-C52CF965-B1B1-4392-B13E-29FBD4DE890F-low.gifFigure 7-6 UGATE Turning Off Voltage and Sink Current vs Time (Related Switching Diagram (right))