SLVSD74D December 2015 – December 2019 TPS2H160-Q1
Thermal shutdown is active when the absolute temperature TJ > T(SD). When thefrmal shutdown occurs, the respective output turns off. The THER pin is used to configure the behavior after the thermal shutdown occurs.
Thermal swing activates when the power FET temperature is increasing sharply, that is, when ΔT = T(FET) – T(Logic) > T(sw), then the output turns off. The output automatically recovers and the fault signal clears when ΔT = T(FET) – T(Logic) < T(sw) – T(hys). Thermal swing function improves the device reliability when subjected to repetitive fast thermal variation. As shown in Figure 32, multiple thermal swings are triggered before thermal shutdown occurs.