SLVSDZ5A February 2018 – January 2020 TPS2HB50-Q1
PRODUCTION DATA.
THERMAL METRIC(1)(2) | TPS2HB50-Q1 | UNIT | |
---|---|---|---|
PWP (HTSSOP) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 34.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 29.0 | °C/W |
RθJB | Junction-to-board thermal resistance | 11.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 4.3 | °C/W |
ψJB | Junction-to-board characterization parameter | 11.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.0 | °C/W |