SBVS341A July   2017  – February 2024 TPS3710-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input (SENSE)
      2. 6.3.2 Output (OUT)
      3. 6.3.3 Immunity to Input-Pin Voltage Transients
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation (VDD > UVLO)
      2. 6.4.2 Undervoltage Lockout (V(POR) < VDD < UVLO)
      3. 6.4.3 Power-On Reset (VDD < V(POR))
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 VPULLUP to a Voltage Other Than VDD
      2. 7.1.2 Monitoring VDD
      3. 7.1.3 Monitoring a Voltage Other Than VDD
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Resistor Divider Selection
        2. 7.2.2.2 Pullup Resistor Selection
        3. 7.2.2.3 Input Supply Capacitor
        4. 7.2.2.4 Sense Capacitor
      3. 7.2.3 Application Curve
    3. 7.3 Do's and Don'ts
    4. 7.4 Power-Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC (1)TPS3710-Q1UNIT
DSE (WSON)
6 PINS
RθJAJunction-to-ambient thermal resistance194.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance128.9°C/W
RθJBJunction-to-board thermal resistance153.8°C/W
ψJTJunction-to-top characterization parameter11.9°C/W
ψJBJunction-to-board characterization parameter157.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.