SNVSCN2A September   2024  – September 2025 TPS37100-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Voltage (VDD)
        1. 7.3.1.1 Undervoltage Lockout (VPOR < VDD < UVLO)
        2. 7.3.1.2 Power-On Reset (VDD < VPOR )
      2. 7.3.2 SENSE
        1. 7.3.2.1 Adjustable Voltage Thresholds
        2. 7.3.2.2 SENSE Hysteresis
        3. 7.3.2.3 Reverse Polarity Protection
      3. 7.3.3 Output Logic Configurations
        1. 7.3.3.1 Open-Drain
        2. 7.3.3.2 Active-Low (OUT A and OUT B)
      4. 7.3.4 User-Programmable Release Time Delay
        1. 7.3.4.1 Deassertion Time Delay Configuration
      5. 7.3.5 User-Programmable Sense Delay
        1. 7.3.5.1 Sense Time Delay Configuration
      6. 7.3.6 Analog Out
      7. 7.3.7 Built-in Self-Test
        1. 7.3.7.1 Latch
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design 1: Off-Battery Monitoring
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Dissipation and Device Operation
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Creepage Distance
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.1 Power Dissipation and Device Operation

The permissible power dissipation for any package is a measure of the capability of the device to pass heat from the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus, the power dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces between the die junction and ambient air.

The maximum continuous allowable power dissipation for the device in a given package can be calculated using Equation 13:

Equation 13. PD-MAX = ((TJ-MAX – TA) / RθJA)

The actual power being dissipated in the device can be represented by Equation 14:

Equation 14. PD = VDD × IDD + POUT A +POUT B

POUT A and POUT B are calculated by Equation 15 or Equation 16. VOUT A and VOUT B depend on the assertion status of the outputs.

Equation 15. POUT A = VOUT A x IOUT A
Equation 16. POUTB = VOUT B x IOUT B

Equation 13 and Equation 14 establish the relationship between the maximum power dissipation allowed due to thermal consideration, the voltage drop across the device, and the continuous current capability of the device. These two equations must be used to determine the optimum operating conditions for the device in the application.

In applications where lower power dissipation (PD) and/or excellent package thermal resistance (RθJA) is present, the maximum ambient temperature (TA-MAX) can be increased.

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature (TA-MAX) have to be de-rated. TA-MAX is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum allowable power dissipation in the device package in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by Equation 17:

Equation 17. TA-MAX = (TJ-MAX-OP – (RθJA × PD-MAX))