SNVSCM8A October   2023  – December 2023 TPS3762

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Specifications
    2. 6.2 Absolute Maximum Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Requirements
    7. 6.7 Timing Requirements
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristic
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Voltage (VDD)
        1. 7.3.1.1 Undervoltage Lockout (VPOR < VDD < UVLO)
        2. 7.3.1.2 Power-On Reset (VDD < VPOR )
      2. 7.3.2 SENSE
        1. 7.3.2.1 Reverse Polarity Protection
        2. 7.3.2.2 SENSE Hysteresis
      3. 7.3.3 Output Logic Configurations
        1. 7.3.3.1 Open-Drain
        2. 7.3.3.2 Active-Low (RESET)
        3. 7.3.3.3 Latching
      4. 7.3.4 User-Programmable Reset Time Delay
        1. 7.3.4.1 Reset Time Delay Configuration
      5. 7.3.5 User-Programmable Sense Delay
        1. 7.3.5.1 Sense Time Delay Configuration
      6. 7.3.6 Built-In Self-Test
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Adjustable Voltage Thresholds
    3. 8.3 Typical Application
      1. 8.3.1 Design 1: SELV Power Supply Monitoring
        1. 8.3.1.1 Design Requirements
        2. 8.3.1.2 Detailed Design Procedure
          1. 8.3.1.2.1 Setting Voltage Threshold
          2. 8.3.1.2.2 Meeting the Sense and Reset Delay
          3. 8.3.1.2.3 Setting Supply Voltage
          4. 8.3.1.2.4 Initiating Built-In Self-Test and Clearing Latch
        3. 8.3.1.3 Application Curves
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Power Dissipation and Device Operation
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Power Dissipation and Device Operation

The permissible power dissipation for any package is a measure of the capability of the device to pass heat from the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus, the power dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces between the die junction and ambient air.

The maximum continuous allowable power dissipation for the device in a given package can be calculated using Equation 10:

Equation 10. PD-MAX = ((TJ-MAX – TA) / RθJA)

The actual power being dissipated in the device can be represented by Equation 11:

Equation 11. PD = VDD × IDD + pRESET

pRESET is calculated by Equation 12 or Equation 13

Equation 12. pRESET (PUSHPULL) = VDD - VRESET x IRESET
Equation 13. pRESET (OPEN-DRAIN) = VRESET x IRESET

Equation 10 and Equation 11 establish the relationship between the maximum power dissipation allowed due to thermal consideration, the voltage drop across the device, and the continuous current capability of the device. These two equations should be used to determine the optimum operating conditions for the device in the application.

In applications where lower power dissipation (PD) and/or excellent package thermal resistance (RθJA) is present, the maximum ambient temperature (TA-MAX) may be increased.

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature (TA-MAX) may have to be de-rated. TA-MAX is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum allowable power dissipation in the device package in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by Equation 14:

Equation 14. TA-MAX = (TJ-MAX-OP – (RθJA × PD-MAX))