SBVS172B July   2011  – April 2015

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Pin (SENSE)
      2. 8.3.2 Enable Pin (ENABLE)
      3. 8.3.3 Output Pin (SENSE_OUT)
      4. 8.3.4 Output Delay Time Pin (CT)
      5. 8.3.5 Immunity To Sense Pin Voltage Transients
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation (VDD > VDD(min))
      2. 8.4.2 Below VDD(min) (V(POR) < VDD < VDD(min))
      3. 8.4.3 Below Power-On Reset (VDD < V(POR))
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Single-Rail Monitoring
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Multiple Voltage Monitoring Sequential Delay
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Multiple Voltage Monitoring Minimum Delay
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
      4. 9.2.4 Voltage Sequencing
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Evaluation Modules
        2. 12.1.1.2 Spice Models
      2. 12.1.2 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted).(1)
MIN MAX UNIT
Voltage(2) VCC –0.3 7 V
CT –0.3 VCC + 0.3
ENABLE, SENSE, SENSE_OUT (push-pull) –0.3 7
SENSE_OUT (open drain) –0.3 20
SENSE_OUT (push-pull) –0.3 7
Current SENSE_OUT ±10 mA
Temperature Operating junction, TJ –40 125 °C
Storage, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to network ground terminal.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Input supply voltage 1.7 6.5 V
VENABLE, VENABLE ENABLE and ENABLE pin voltage 0 6.5 V
VSENSE SENSE pin voltage 0 6.5 V
VSENSE_OUT, VSENSE_OUT (open drain) SENSE_OUT, SENSE_OUT pin voltage 0 18 V
VSENSE_OUT, VSENSE_OUT (push-pull) SENSE_OUT, SENSE_OUT pin voltage 0 VCC V
ISENSE_OUT, ISENSE_OUT SENSE_OUT, SENSE_OUT pin current 0.0003 1 mA

7.4 Thermal Information

THERMAL METRIC(1) TPS389x UNIT
DRY (USON)
6 PINS
RθJA Junction-to-ambient thermal resistance 293.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 165.1
RθJB Junction-to-board thermal resistance 160.8
ψJT Junction-to-top characterization parameter 27.3
ψJB Junction-to-board characterization parameter 65.8
RθJC(bot) Junction-to-case (bottom) thermal resistance 65.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

Over the operating temperature range of TJ = –40°C to 125°C, and 1.7 V < VCC< 6.5 V, unless otherwise noted. Typical values are at TJ = 25°C and VCC = 3.3 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC Supply voltage range TJ = –40°C to 125°C 1.7 6.5 V
TJ = 0°C to 85°C 1.65 6.5
V(POR) Power-on reset voltage(1) VOL (max) = 0.2 V , I(SENSE_OUT) = 15 µA 0.8 V
ICC Supply current (into VCC pin) VCC = 3.3 V , no load 6 12 µA
VCC = 6.5 V , no load 7 12
VIT+ Positive-going input threshold voltage V(SENSE) rising 0.495 0.5 0.505 V
Vhys Hysteresis voltage V(SENSE) falling 5 mV
I(SENSE) Input current(2) V(SENSE) = 0 V or VCC –15 15 nA
I(CT) CT pin charge current 260 310 360 nA
V(CT) CT pin comparator threshold voltage 1.18 1.238 1.299 V
R(CT) CT pin pulldown resistance 200 Ω
VIL Low-level input voltage (ENABLE pin) 0.4 V
VIH High-level input voltage (ENABLE pin) 1.4 V
UVLO Undervoltage lockout(3) VCC falling 1.3 1.7 V
Ilkg Leakage current ENABLE = VCC or GND –100 100 nA
VOL Low-level output voltage VCC ≥ 1.2 V, ISINK = 90 µA (TPS3895/7 only) 0.3 V
VCC ≥ 2.25 V, ISINK = 0.5 mA 0.3
VCC ≥ 4.5 V, ISINK = 1 mA 0.4
VOH High-level output voltage (push-pull) VCC ≥ 2.25 V, ISOURCE = 0.5 mA 0.8VCC V
VCC ≥ 4.5 V, ISOURCE = 1 mA 0.8VCC
Ilkg(OD) Open-drain output leakage current V(SENSE_OUT) high impedance = 18 V 300 nA
(1) The lowest supply voltage (VCC) at which output is active (SENSE_OUT is low, SENSE_OUT is high); tr(VCC) > 15 µs/V. Below V(POR), the output cannot be determined.
(2) Specified by design.
(3) When VCC falls below the UVLO threshold, the output deasserts (SENSE_OUT goes low, SENSE_OUT goes high). Below V(POR), the output cannot be determined.

7.6 Timing Requirements

MIN TYP MAX UNIT
tpd(r) SENSE (rising) to SENSE_OUT propagation delay V(SENSE) rising, C(CT) = open 40 µs
V(SENSE) rising, C(CT) = 0.047 µF 190 ms
tpd(f) SENSE (falling) to SENSE_OUT propagation delay V(SENSE) falling 16 µs
Start-up delay(1) 50 µs
tw ENABLE pin minimum pulse duration 1 µs
ENABLE pin glitch rejection 100 ns
td(OFF) ENABLE to SENSE_OUT delay time (output disabled) ENABLE deasserted to output deasserted 200 ns
td(P) ENABLE to SENSE_OUT delay time (P version) ENABLE asserted to output asserted delay
(P version)
200 ns
td(A) ENABLE to SENSE_OUT delay time (A version) ENABLE asserted to output asserted delay
(A version), C(CT) = open
20 µs
ENABLE asserted to output asserted delay
(A version), C(CT) = 0.047 µF
190 ms
(1) During power on, VCC must exceed 1.7 V for at least 50 µs (plus propagation delay time, tpd(r)) before output is in the correct state.
TPS389 tim_3895a_7a_bvs172.gifFigure 1. TPS3895A and TPS3897A Timing
TPS389 tim_3895p_7p_bvs172.gifFigure 2. TPS3895P and TPS3897P Timing
TPS389 tim_3896a_8a_bvs172.gifFigure 3. TPS3896A and TPS3898A Timing
TPS389 tim_3896p_8p_bvs172.gifFigure 4. TPS3896P and TPS3898P Timing

7.7 Typical Characteristics

At TA = 25°C, and VCC = 3.3 V, unless otherwise noted.
TPS389 G001_bvs172.png
Figure 5. Supply Current vs Supply Voltage
TPS389 G003_bvs172.png
Figure 7. SENSE_OUT Time-Out Period vs Temperature
(CCT = 47 nF)
TPS389 G005_bvs172.png
Figure 9. SENSE Minimum Pulse Duration vs SENSE Threshold Overdrive Voltage
TPS389 G007_bvs172.png
Figure 11. Output Voltage High vs Output Current
(0 mA to 1 mA)
TPS389 G009_bvs172.png
Figure 13. Output Voltage High at 1 mA vs Temperature
TPS389 G011_bvs172.png
Figure 15. Output Voltage High vs Output Current
TPS389 tc_enable_3895p_bvs172.gif
Figure 17. Enable Power On and Power Off Delay (TPS3895P)
TPS389 G002_bvs172.png
Figure 6. SENSE_OUT Time-Out Period vs CCT
TPS389 G004_bvs172.png
Figure 8. SENSE Threshold Voltage vs Temperature
TPS389 G006_bvs172.png
Figure 10. Output Voltage Low vs Output Current (0 mA to
1 mA)
TPS389 G008_bvs172.png
Figure 12. Output Voltage Low at 1 mA vs Temperature
TPS389 G010_bvs172.png
Figure 14. Output Voltage Low vs Output Current
TPS389 tc_enable_3895a_bvs172.gif
Figure 16. Enable Power On and Power Off Delay (TPS3895A)