SLVSB16E November   2011  – December 2015 TPS43340-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable Inputs
      2. 7.3.2 Linear Regulator (LREG1)
      3. 7.3.3 Gate-Driver Supply (VREG, EXTSUP)
      4. 7.3.4 External P-Channel Drive (GPULL) and Reverse Battery Protection
      5. 7.3.5 Undervoltage Lockout and Overvoltage Protection
      6. 7.3.6 Synchronous Buck Converter Buck3
        1. 7.3.6.1 Soft Start and Foldback Functions
        2. 7.3.6.2 Current-Mode Control and Current-Limit Protection
        3. 7.3.6.3 Operation in Dropout and Undervoltage Protection
        4. 7.3.6.4 Slew Rate Control (SLEW)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Buck Controllers: Normal Mode PWM Operation
        1. 7.4.1.1 Setting the Operating Frequency
        2. 7.4.1.2 Feedback Inputs
        3. 7.4.1.3 Soft-Start Inputs
        4. 7.4.1.4 Current-Mode Operation
        5. 7.4.1.5 Current Sensing and Current Limit With Foldback
        6. 7.4.1.6 Slope Compensation
        7. 7.4.1.7 Reset Outputs and Filter Delays
        8. 7.4.1.8 Light-Load PFM Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 High- and Low-Side Power NMOS Selection for the Buck Converters
        2. 8.2.2.2 Buck1 Component Selection
        3. 8.2.2.3 Buck2 Component Selection
        4. 8.2.2.4 Buck3 Component Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
      1. 10.3.1 Power Dissipation of Buck1 and Buck2 (VOUT1 and VOUT2)
      2. 10.3.2 Power Dissipation of Buck Converter Buck3 (VOUT3)
        1. 10.3.2.1 High-Side Switch
        2. 10.3.2.2 Low-Side Switch
        3. 10.3.2.3 Linear Regulator (LREG1)
        4. 10.3.2.4 IC Power Consumption
    4. 10.4 Thermal Considerations
      1. 10.4.1 Phase Configuration
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.