SLUS812E February   2008  – September 2025 TPS51200

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Sink and Source Regulator (VO Pin)
      2. 6.3.2  Reference Input (REFIN Pin)
      3. 6.3.3  Reference Output (REFOUT Pin)
      4. 6.3.4  Soft-Start Sequencing
      5. 6.3.5  Enable Control (EN Pin)
      6. 6.3.6  Powergood Function (PGOOD Pin)
      7. 6.3.7  Current Protection (VO Pin)
      8. 6.3.8  UVLO Protection (VIN Pin)
      9. 6.3.9  Thermal Shutdown
      10. 6.3.10 Tracking Start-up and Shutdown
      11. 6.3.11 Output Tolerance Consideration for VTT DIMM Applications
      12. 6.3.12 REFOUT (VREF) Consideration for DDR2 Applications
    4. 6.4 Device Functional Modes
      1. 6.4.1 Low Input Voltage Applications
      2. 6.4.2 S3 and Pseudo-S5 Support
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Voltage Capacitor
        2. 7.2.2.2 VLDO Input Capacitor
        3. 7.2.2.3 Output Capacitor
      3. 7.2.3 Application Curves
    3. 7.3 System Examples
      1. 7.3.1 3.3VIN, DDR2 Configuration
      2. 7.3.2 2.5VIN, DDR3 Configuration
      3. 7.3.3 3.3VIN, LP DDR3 or DDR4 Configuration
      4. 7.3.4 3.3VIN, DDR3 Tracking Configuration
      5. 7.3.5 3.3VIN, LDO Configuration
      6. 7.3.6 3.3VIN, DDR3 Configuration with LFP
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
      3. 7.5.3 Thermal Design Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Modules
        2. 8.1.1.2 Spice Models
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.1 3.3VIN, DDR2 Configuration

This section describes a 3.3VIN, DDR2 configuration application.

TPS51200 3.3VIN, DDR2 ConfigurationFigure 7-5 3.3VIN, DDR2 Configuration
Table 7-2 3.3VIN, DDR2 Configuration List of Materials
REFERENCE DESIGNATORDESCRIPTIONSPECIFICATIONPART NUMBERMANUFACTURER
R1, R2Resistor10kΩ
R3100kΩ
R4, R5100Ω
C1, C2, C3Capacitor10μF, 6.3VGRM21BR70J106KE76LMurata
C41000pF
C50.1μF
C64.7μF, 6.3VGRM21BR60J475KA11LMurata
C7, C810μF, 6.3VGRM21BR70J106KE76LMurata