SLVSAU1E May   2011  – August 2016 TPS54228

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation
      2. 7.3.2 PWM Frequency and Adaptive On-Time Control
      3. 7.3.3 Auto-Skip Eco-Mode™ Control
      4. 7.3.4 Soft Start and Prebiased Soft Start
      5. 7.3.5 Current Protection
      6. 7.3.6 UVLO Protection
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Standby Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage Resistors Selection
        2. 8.2.2.2 Output Filter Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Bootstrap Capacitor Selection
        5. 8.2.2.5 VREG5 Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VIN, EN –0.3 20 V
VBST –0.3 26
VBST (transient, 10 ns) –0.3 28
VBST (vs SW) –0.3 6.5
VFB, SS –0.3 6.5
SW –2 20
SW (transient, 10 ns) –3 22
Output voltage VREG5 –0.3 6.5 V
GND –0.3 0.3
Voltage from GND to thermal pad, Vdiff –0.2 0.2 V
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range and VIN = 12 V (unless otherwise noted)
MIN NOM MAX UNIT
VIN Supply input voltage 4.5 18 V
VI Input voltage VBST –0.1 24 V
VBST (transient, 10 ns) –0.1 27
VBST(vs SW) –0.1 5.7
SS –0.1 5.7
EN –0.1 18
VFB –0.1 5.5
SW –1.8 18
SW (transient, 10 ns) –3 21
GND –0.1 0.1
VO Output voltage, VREG5 –0.1 5.7 V
IO Output current, IVREG5 0 10 mA
IOUT Operating output current(1) 2 A
TA Operating free-air temperature –40 85 °C
(1) D package, VOUT > 5 V (see Figure 9 for temperature derating)

6.4 Thermal Information

THERMAL METRIC(1) TPS54228 UNITS
DDA (SO) D (SOIC) DRC (VSON)
8 PINS 8 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 45.3 114.4 43.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54.8 60.8 55.4 °C/W
RθJB Junction-to-board thermal resistance 16.2 55.7 18.9 °C/W
ψJT Junction-to-top characterization parameter 6.6 17.4 0.7 °C/W
ψJB Junction-to-board characterization parameter 16 55.1 19.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 8.5 — 5.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over operating free-air temperature range and VIN = 12 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IVIN Operating, non-switching supply current VIN current, TA = 25°C, EN = 5 V,
VFB = 0.8 V		 800 1200 µA
IVINSDN Shutdown supply current VIN current, TA = 25°C, EN = 0 V 5 10 µA
LOGIC THRESHOLD
VEN EN high-level input voltage EN 1.6 V
EN low-level input voltage EN 0.6 V
REN EN pin resistance to GND VEN = 12 V 220 440 880 kΩ
VFB VOLTAGE AND DISCHARGE RESISTANCE
VFBTH VFB threshold voltage TA = 25°C, VO = 1.05 V, IO = 10 mA,
Eco-Mode™ operation		 770 mV
TA = 25°C, VO = 1.05 V,
continuous mode operation		 749 765 781 mV
IVFB VFB input current VFB = 0.8 V, TA = 25°C 0 ±0.1 µA
VREG5 OUTPUT
VVREG5 VREG5 output voltage TA = 25°C, 6 V < VIN < 18 V,
0 < IVREG5 < 5 mA		 5.2 5.5 5.7 V
VLN5 Line regulation 6 V < VIN < 18 V, IVREG5 = 5 mA 25 mV
VLD5 Load regulation 0 mA < IVREG5 < 5 mA 100 mV
IVREG5 Output current VIN = 6 V, VREG5 = 4 V, TA = 25°C 60 mA
MOSFET
RDS(on) High side switch resistance DDA and D packages 25°C, VBST – SW = 5.5 V 155 mΩ
DRC package, 25°C, VBST – SW = 5.5 V 165
Low side switch resistance 25°C 108
Iocl Current limit DDA and DRC packages, L out = 2.2 µH(1) 2.5 3.3 4.7 A
D package, L out = 2.2 µH(1) 2.3 3 4.5 A
TSDN Thermal shutdown threshold Shutdown temperature(1) 165 °C
Hysteresis(1) 35
tON On time VIN = 12 V, VO = 1.05 V 150 ns
tOFF(MIN) Minimum off time TA = 25°C, VFB = 0.7 V 260 310 ns
ISS Soft-start charge current VSS = 1 V 1.4 2 2.6 µA
Soft-start discharge current VSS = 0.5 V 0.1 0.2 mA
UVLO Undervoltage lockout threshold Wake up VREG5 voltage 3.45 3.75 4.05 V
Hysteresis VREG5 voltage 0.13 0.32 0.48
(1) Not production tested.

6.6 Typical Characteristics

VIN = 12 V and TA = 25 °C (unless otherwise noted)
TPS54228 icc_tj_lvsau1.gif Figure 1. VIN Current vs Junction Temperature
TPS54228 cur_vi_lvsag1.gif Figure 3. EN Current vs EN Voltage
TPS54228 vo_vi_lvsau1.gif Figure 5. 1.05-V Output Voltage vs Input Voltage
TPS54228 fsw_io_lvsau1.gif Figure 7. Switching Frequency vs Output Current
TPS54228 Iout_ta.png Figure 9. D Package Output Current
vs Ambient Temperature
TPS54228 Iccsdn_tj_lvsau1.gif Figure 2. VIN Shutdown Current vs
Junction Temperature
TPS54228 vo_io_lvsau1.gif Figure 4. 1.05-V Output Voltage vs Output Current
TPS54228 fsw_vi_lvsau1.gif Figure 6. Switching Frequency vs Input Voltage
TPS54228 Vfbth_v_Temp_lsvau1.gif Figure 8. Vfb Voltage vs Junction Temperature
TPS54228 PD_ta.png Figure 10. Power Dissipation vs Ambient Temperature