SLVSGT7 april   2023 TPS552892-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VCC Power Supply
      2. 7.3.2  EXTVCC Power Supply
      3. 7.3.3  Input Undervoltage Lockout
      4. 7.3.4  Enable and Programmable UVLO
      5. 7.3.5  Soft Start
      6. 7.3.6  Shutdown
      7. 7.3.7  Switching Frequency
      8. 7.3.8  Switching Frequency Dithering
      9. 7.3.9  Inductor Current Limit
      10. 7.3.10 Internal Charge Path
      11. 7.3.11 Output Voltage Setting
      12. 7.3.12 Output Current Monitoring and Cable Voltage Droop Compensation
      13. 7.3.13 Output Current Limit
      14. 7.3.14 Overvoltage Protection
      15. 7.3.15 Output Short Circuit Protection
      16. 7.3.16 Power Good
      17. 7.3.17 Constant Current Output Indication
      18. 7.3.18 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Mode
      2. 7.4.2 Power Save Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Switching Frequency
        2. 8.2.2.2 Output Voltage Setting
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Input Capacitor
        5. 8.2.2.5 Output Capacitor
        6. 8.2.2.6 Output Current Limit
        7. 8.2.2.7 Loop Stability
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) RYQ (VQFN) RYQ (VQFN) UNIT
21 PINS 21 PINS
Standard EVM (2)
RθJA Junction-to-ambient thermal resistance 43.4 27.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 22.3 N/A °C/W
RθJB Junction-to-board thermal resistance 7.4 N/A °C/W
ΨJT Junction-to-top characterization parameter 0.7 0.7 °C/W
YJB Junction-to-board characterization parameter 7.2 11.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Measured on TPS552892EVM-111, 4-layer, 2-oz/1-oz/1-oz/2-oz copper 91-mmx66-mm PCB.