SLVS939B June   2009  – December 2014 TPS55332-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage (VIN)
      2. 7.3.2  Output Voltage (Vout)
      3. 7.3.3  Regulated Supply Voltage (VReg)
      4. 7.3.4  Over-Current Protection (SW)
      5. 7.3.5  Oscillator Frequency (RT)
      6. 7.3.6  Enable / Shutdown (EN)
      7. 7.3.7  Reset Delay (Cdly)
      8. 7.3.8  Reset Pin (RST)
      9. 7.3.9  Boost Capacitor (BOOT)
      10. 7.3.10 Soft Start (SS)
      11. 7.3.11 Synchronization (SYNC)
      12. 7.3.12 Regulation Voltage (VSENSE)
      13. 7.3.13 Reset Threshold (RST_TH)
      14. 7.3.14 Slew Rate Control (Rslew)
      15. 7.3.15 Thermal Shutdown
      16. 7.3.16 Loop Control Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 DCM Operation
      2. 7.4.2 CCM Operation
      3. 7.4.3 Loop Compensation For Stability Criteria
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Output Capacitor (Co)
        2. 8.2.2.2  Output Inductor Selection (Lo) for CCM
        3. 8.2.2.3  Output Diode
        4. 8.2.2.4  Input Capacitor CI
        5. 8.2.2.5  Output Voltage And Feedback Resistor Selection
        6. 8.2.2.6  Reset Threshold Resistor Selection
        7. 8.2.2.7  Soft Start Capacitor
        8. 8.2.2.8  Loop Compensation Calculation
        9. 8.2.2.9  Loop Compensation Response
        10. 8.2.2.10 Output Inductor Selection (LO) For DCM
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Inductor
      2. 10.1.2 Input Filter Capacitors
      3. 10.1.3 Feedback
      4. 10.1.4 Traces And Ground Plane
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.