SLVS939B June   2009  – December 2014 TPS55332-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage (VIN)
      2. 7.3.2  Output Voltage (Vout)
      3. 7.3.3  Regulated Supply Voltage (VReg)
      4. 7.3.4  Over-Current Protection (SW)
      5. 7.3.5  Oscillator Frequency (RT)
      6. 7.3.6  Enable / Shutdown (EN)
      7. 7.3.7  Reset Delay (Cdly)
      8. 7.3.8  Reset Pin (RST)
      9. 7.3.9  Boost Capacitor (BOOT)
      10. 7.3.10 Soft Start (SS)
      11. 7.3.11 Synchronization (SYNC)
      12. 7.3.12 Regulation Voltage (VSENSE)
      13. 7.3.13 Reset Threshold (RST_TH)
      14. 7.3.14 Slew Rate Control (Rslew)
      15. 7.3.15 Thermal Shutdown
      16. 7.3.16 Loop Control Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 DCM Operation
      2. 7.4.2 CCM Operation
      3. 7.4.3 Loop Compensation For Stability Criteria
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Output Capacitor (Co)
        2. 8.2.2.2  Output Inductor Selection (Lo) for CCM
        3. 8.2.2.3  Output Diode
        4. 8.2.2.4  Input Capacitor CI
        5. 8.2.2.5  Output Voltage And Feedback Resistor Selection
        6. 8.2.2.6  Reset Threshold Resistor Selection
        7. 8.2.2.7  Soft Start Capacitor
        8. 8.2.2.8  Loop Compensation Calculation
        9. 8.2.2.9  Loop Compensation Response
        10. 8.2.2.10 Output Inductor Selection (LO) For DCM
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Inductor
      2. 10.1.2 Input Filter Capacitors
      3. 10.1.3 Feedback
      4. 10.1.4 Traces And Ground Plane
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VI Unregulated input voltages (VIN, EN)(2) ( SW) (2)(3) –0.3 60 V
Unregulated input voltages (BOOT) –0.3 8 V
VReg Regulated voltage –0.3 60 V
Logic level signals (RT, RST, SYNC, VSENSE, RST_TH) (2) –0.3 5.5 V
Logic level signals (SS, Cdly) (2) –0.3 8 V
Logic level signals (COMP)(2) –0.3 7 V
TJ Operating virtual junction temperature range –40 150 °C
Tstg Storage temperature –55 165 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) Absolute negative voltage on these pins not to go below –0.6 V.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±2000 V
Charged device model (CDM), per AEC Q100-011 Corner pins (NC, BOOT, SS, and GND) ±750
Other pins ±500
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VI Unregulated buck supply input voltage (VIN, EN) 3.6 40 V
VReg Output voltage range 2.5 50 V
Bootstrap capacitor (BOOT) 3.6 8 V
Switched outputs (SW) 3.6 52 V
Logic level inputs (RST, VSENSE, RST_TH, Rslew, SYNC, RT) 0 5.25 V
Logic level inputs (SS, Cdly, COMP) 0 6.5 V
θJA Thermal resistance, junction to ambient(1) 35 °C/W
θJC Thermal resistance, junction to case(2) 10 °C/W
TJ Operating junction, temperature range(3) –40 150 °C
(1) This assumes a JEDEC JESD 51-5 standard board with thermal vias and high-K profile – See PowerPAD section and application note from Texas Instruments (SLMA002) for more information.
(2) This assumes junction to exposed PAD.
(3) This assumes TA = TJ – power dissipation × θJA (junction to ambient).

6.4 Thermal Information

THERMAL METRIC(1) TPS55332-Q1 UNIT
PWP
20 PINS
RθJA Junction-to-ambient thermal resistance 43.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.4
RθJB Junction-to-board thermal resistance 18.5
ψJT Junction-to-top characterization parameter 0.5
ψJB Junction-to-board characterization parameter 18.3
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

VIN = 7 V to 40 V, EN = High, TJ = –40°C to 150°C (unless otherwise noted)
TEST PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT VOLTAGE (VIN)
Info VIN Supply voltage on VIN line Normal mode – buck mode after start up 1.5 40 V
PT Iq-Normal Bias current, normal mode 4.2 8 mA
PT ISD Shutdown EN = 0 V, VIN = 12 V, TA = 25°C 2 4 μA
SWITCH MODE SUPPLY; VReg/Vout
Info VReg Regulator output VSENSE = 2.5 V in boost mode (1) Vin×1.05 50 V
CT VSENSE Feedback voltage VIN = 12 V 2.463 2.5 2.538 V
PT RDS(on) Internal switch resistance Measured across VSWD and GND 500 mΩ
Info ICL Switch current limit VIN = 7 V to 28 V 5.7 A
Info tON-Min Duty cycle pulse width Bench mode = 500 kHz 50 100 150 ns
tOFF-Min 50 100 150
PT fsw Switch mode frequency Set using external resistor on RT pin 80 2200 kHz
PT fsw Internal oscillator frequency –10% 10%
ENABLE (EN)
PT VIL Low input threshold 0.7 V
PT VIH High input threshold 1.7 V
PT ILeakage Leakage into EN terminal EN = 24 V 35 μA
RESET DELAY (CDLY)
PT IO External capacitor charge current EN = high 1.4 2 2.6 μA
PT VThreshold Switching threshold Output voltage in regulation 1.8 2 2.4 V
RESET OUTPUT (RST)
Info trdly POR delay timer Based on Cdly capacitor, Cdly = 4.7 nF 3.6 7 ms
PT RST_TH Reset threshold for VReg Check RST output 0.768 0.832 V
PT tRSTdly Filter time Once VRST_TH or OV_TH Is detected, delay before RST Is asserted low 10 20 35 μs
SYNCHRONIZATION (SYNC)
PT VSYNC Low-level input voltage, VIL 0.7 V
PT High-level input voltage, VIH 1.7 V
PT ILeakage Leakage current SYNC = 5 V 65 95 μA
PT SYNC Input clock VIN = 12 V, fsw < fext < 2 × fsw 80 2200 kHz
Info SYNCtrans External clock to internal clock No external clock, VIN = 12 V 32 μs
Info SYNCtrans Internal clock to external clock External clock = 500 kHz, VIN = 12 V 2.5 μs
CT SYNCCLK Minimum duty cycle 30%
CT SYNCCLK Maximum duty cycle 70%
Rslew
CT IRslew Slew current Rslew = 50 kΩ, Calculated not measured 20 μA
CT IRslew Slew current Rslew = 50 kΩ, Calculated not measured 100 μA
Soft Start (SS)
PT Iss Soft start current 40 50 60 μA
THERMAL SHUTDOWN
CT TSD Thermal shutdown junction temperature 175 200 °C
CT THYS Hysteresis 30 °C
PT:
CT:
Info:		 Production tested
Characterization tested only, not production tested
User Information only, not production tested
(1) Voltage ratio of input to output in boost mode is 1:10 (max) and up to 50 V output max.

6.6 Typical Characteristics

g003_lvs939.gif
Figure 1. Vsense Ref Voltage (V) vs Temperature (°C)
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Figure 3. Rds Of Power Fet (Ω) vs Temperature (°C)
g004_lvs939.gif
Figure 2. VIN Leakage Current (Μa) vs Temperature (°C)
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Figure 4. Normal Current Consumption (mA) vs Temperature (°C)