SLVSCB0E january   2014  – may 2023 TPS562200 , TPS563200

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings #GUID-10807E29-2FD4-4A3F-94B2-FDEBD147A133/SLVSC819633
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics TPS562200
    8. 6.8 Typical Characteristics TPS563200
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 The Adaptive On-Time Control And PWM Operation
      2. 7.3.2 Advanced Eco-mode Control
      3. 7.3.3 Soft Start And Pre-Biased Soft Start
      4. 7.3.4 Current Protection
      5. 7.3.5 Over Voltage Protection
      6. 7.3.6 UVLO Protection
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Eco-mode Operation
      3. 7.4.3 Standby Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Tps562200 4.5-V To 17-V Input, 1.05-V Output Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedures
          1. 8.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 8.2.1.2.2 Output Voltage Resistors Selection
          3. 8.2.1.2.3 Output Filter Selection
          4. 8.2.1.2.4 Input Capacitor Selection
          5. 8.2.1.2.5 Bootstrap Capacitor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Tps563200 4.5-V To 17-V Input, 1.05-V Output Converter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedures
          1. 8.2.2.2.1 Output Filter Selection
        3. 8.2.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Custom Design with WEBENCH® Tools
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, And Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

  1. VIN and GND traces must be as wide as possible to reduce trace impedance. The wide areas are also of advantage from the view point of heat dissipation.
  2. The input capacitor and output capacitor must be placed as close to the device as possible to minimize trace impedance.
  3. Provide sufficient vias for the input capacitor and output capacitor.
  4. Keep the SW trace as physically short and wide as practical to minimize radiated emissions.
  5. Do not allow switching current to flow under the device.
  6. A separate VOUT path must be connected to the upper feedback resistor
  7. Make a Kelvin connection to the GND pin for the feedback path.
  8. Voltage feedback loop must be placed away from the high-voltage switching trace, and preferably has ground shield.
  9. The trace of the VFB node must be as small as possible to avoid noise coupling.
  10. The GND trace between the output capacitor and the GND pin must be as wide as possible to minimize its trace impedance.