SGLS276D January   2005  – March 2016 TPS61040-Q1 , TPS61041-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Peak Current Control
      2. 7.3.2 Soft Start
      3. 7.3.3 Enable
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection, Maximum Load Current
        2. 8.2.2.2 Setting The Output Voltage and Feed-Forward Capacitor
        3. 8.2.2.3 Line and Load Regulation
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 Diode Selection
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Community Resource
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltages on pin VIN (2) –0.3 7 V
Voltages on pins EN, FB (2) –0.3 VIN + 0.3 V
Switch voltage on pin SW (2) 30 V
Continuous power dissipation See Thermal Information
TJ Operating junction temperature –40 150 °C
TStg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 ±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

MIN TYP MAX UNIT
VIN Input voltage 1.8 6 V
VOUT Output voltage 28 V
L Inductor(1) 2.2 10 47 μH
f Switching frequency(1) 1 MHz
CIN Input capacitor (1) 4.7 μF
COUT Output capacitor (1) 1 μF
TA Operating ambient temperature –40 125 °C
(1) See Application and Implementation section for further information.

6.4 Thermal Information

THERMAL METRIC(1) TPS6104x-Q1 UNIT
DBV (SOT-23)
5 PINS
RθJA Junction-to-ambient thermal resistance 153.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 105.7 °C/W
RθJB Junction-to-board thermal resistance 33.5 °C/W
ψJT Junction-to-top characterization parameter 9.8 °C/W
ψJB Junction-to-board characterization parameter 33.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

VIN = 2.4 V, EN = VIN, TA = –40°C to 125°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
VIN Input voltage range 1.8 6 V
IQ Operating quiescent current IOUT = 0 mA, not switching, VFB = 1.3 V 28 50 μA
ISD Shutdown current EN = GND 0.1 1 μA
VUVLO Undervoltage lockout threshold 1.5 1.7 V
ENABLE
VIH EN high level input voltage 1.3 V
VIL EN low level input voltage 0.4 V
II EN input leakage current EN = GND or VIN 0.1 1 μA
POWER SWITCH AND CURRENT LIMIT
Vsw Maximum switch voltage 30 V
toff Minimum OFF time 250 400 550 ns
ton Maximum ON time 4 6 7.5 μs
RDS(on) MOSFET ON-resistance VIN = 2.4 V; ISW = 200 mA; TPS61040-Q1 600 1100 mΩ
RDS(on) MOSFET ON-resistance VIN = 2.4 V; ISW = 200 mA; TPS61041-Q1 750 1300 mΩ
MOSFET leakage current VSW = 28 V 1 10 μA
ILIM MOSFET current limit TPS61040-Q1 325 400 500 mA
ILIM MOSFET current limit TPS61041-Q1 200 250 325 mA
OUTPUT
VOUT Adjustable output voltage range(2) VIN 28 V
Vref Internal voltage reference 1.233 V
IFB Feedback input bias current VFB = 1.3 V 1 μA
VFB Feedback trip point voltage 1.8 V ≤ VIN ≤ 6 V TJ = –40°C to 85°C 1.208 1.233 1.258 V
TJ = –40°C to 125°C 1.2 1.233 1.27
Line regulation (1) 1.8 V ≤ VIN ≤ 6 V; VOUT = 18 V; Iload = 10 mA;
CFF = not connected		 0.05 %/V
Load regulation(1) VIN = 2.4 V; VOUT = 18 V; 0 mA ≤ IOUT ≤ 30 mA 0.15 %/mA
(1) The line and load regulation depend on the external component selection. See Application and Implementation for further information.
(2) Cannot be production tested. Assured by design.

6.6 Typical Characteristics

Table 1. Table of Graphs

FIGURE
η Efficiency vs Load current Figure 1, Figure 2, Figure 3
vs Input voltage Figure 4
IQ Quiescent current vs Input voltage and temperature Figure 5
VFB Feedback voltage vs Temperature Figure 6
ISW Switch current limit vs Temperature Figure 7
ICL Switch current limit vs Supply voltage, TPS61041-Q1 Figure 8
vs Supply voltage, TPS61040-Q1 Figure 9
RDS(on) RDS(on) vs Temperature Figure 10
vs Supply voltage Figure 11
Line transient response Figure 13
Load transient response Figure 14
Start-up behavior Figure 15
TPS61040-Q1 TPS61041-Q1 tc_eff_gls276.gif
Figure 1. Efficiency vs Output Current
TPS61040-Q1 TPS61041-Q1 tc_eff3_gls276.gif
Figure 3. Efficiency vs Load Current
TPS61040-Q1 TPS61041-Q1 tc_qu_gls276.gif
Figure 5. TPS61040-Q1 Quiescent Current vs Input Voltage
TPS61040-Q1 TPS61041-Q1 tc_scl_gls276.gif
Figure 7. TPS6104x-Q1 Switch Current Limit vs Free-Air Temperature
TPS61040-Q1 TPS61041-Q1 tc_curr2_gls276.gif
Figure 9. TPS61040-Q1 Current Limit vs Supply Voltage
TPS61040-Q1 TPS61041-Q1 tc_stat2_gls276.gif
Figure 11. TPS6104x-Q1 Static Drain-Source ON-State Resistance vs Supply Voltage
TPS61040-Q1 TPS61041-Q1 tc_eff2_gls276.gif
Figure 2. Efficiency vs Load Current
TPS61040-Q1 TPS61041-Q1 tc_eff4_gls276.gif
Figure 4. Efficiency vs Input Voltage
TPS61040-Q1 TPS61041-Q1 tc_feed_gls276.gif
Figure 6. Feedback Voltage vs Free-Air Temperature
TPS61040-Q1 TPS61041-Q1 tc_curr_gls276.gif
Figure 8. TPS61041-Q1 Current Limit vs Supply Voltage
TPS61040-Q1 TPS61041-Q1 tc_stat_gls276.gif
Figure 10. TPS6104x-Q1 Static Drain-Source ON-State Resistance vs Free-Air Temperature