SLVSCQ7 April   2015 TPS61046


  1. Features
  2. Applications
  3. Description
  4. Simplified Schematic
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Under-Voltage Lockout
      2. 8.3.2 Enable and Disable
      3. 8.3.3 Soft Start
      4. 8.3.4 Over-voltage Protection
      5. 8.3.5 Output Short Circuit Protection
      6. 8.3.6 Thermal Shutdown
      7. 8.3.7 Device Functional Modes
        1. PWM Mode
      8. 8.3.8 Power Save Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application - 12-V Output Boost Converter
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. Programming the Output Voltage
        2. Inductor Selection
        3. Input and Output Capacitor Selection
      3. 9.2.3 Application Performance Curves
    3. 9.3 System Examples
      1. 9.3.1 Fixed 12-V Output Voltage with Three External Components
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

As for all switching power supplies, especially those running at high switching frequency and high currents, layout is an important design step. If the layout is not carefully done, the regulator could suffer from instability and noise problems. To maximize efficiency, switch rise and fall time are very fast. To prevent radiation of high frequency noise (for example, EMI), proper layout of the high-frequency switching path is essential. Minimize the length and area of all traces connected to the SW pin, and always use a ground plane under the switching regulator to minimize interplane coupling. The input capacitor needs not only to be close to the VIN pin, but also to the GND pin in order to reduce input supply ripple.

The most critical current path for all boost converters is from the switching FET, through the rectifier diode, then the output capacitors, and back to ground of the switching FET. This high current path contains nanosecond rise and fall time and should be kept as short as possible. Therefore, the output capacitor needs not only to be close to the VOUT pin, but also to the GND pin to reduce the overshoot at the SW pin and VOUT pin.

11.2 Layout Example

A large ground plane on the bottom layer connects the ground pins of the components on the top layer through vias.

TPS61046 layout_ex_slvscq7.gifFigure 20. PCB Layout Example