SLVSCQ7 April 2015 TPS61046
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Chip scale package dimensions
The TPS61046 is available in a 6-bump chip scale package (YFF, NanoFree™). The package dimensions are given as:
D=ca. 1192 ± 30µm
E=ca. 792 ± 30µm