SLVSCQ7 April   2015 TPS61046

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematic
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Under-Voltage Lockout
      2. 8.3.2 Enable and Disable
      3. 8.3.3 Soft Start
      4. 8.3.4 Over-voltage Protection
      5. 8.3.5 Output Short Circuit Protection
      6. 8.3.6 Thermal Shutdown
      7. 8.3.7 Device Functional Modes
        1. 8.3.7.1 PWM Mode
      8. 8.3.8 Power Save Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application - 12-V Output Boost Converter
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Programming the Output Voltage
        2. 9.2.2.2 Inductor Selection
        3. 9.2.2.3 Input and Output Capacitor Selection
      3. 9.2.3 Application Performance Curves
    3. 9.3 System Examples
      1. 9.3.1 Fixed 12-V Output Voltage with Three External Components
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Package summary

Chip scale package dimensions

The TPS61046 is available in a 6-bump chip scale package (YFF, NanoFree™). The package dimensions are given as:

D=ca. 1192 ± 30µm

E=ca. 792 ± 30µm