SLVSBG1D October   2012  – May 2015 TPS61196

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Supply Voltage
      2. 7.3.2 Boost Controller
      3. 7.3.3 Switching Frequency
      4. 7.3.4 Enable and Undervoltage Lockout
      5. 7.3.5 Power-up Sequencing and Soft Start-up
      6. 7.3.6 Unused LED String
      7. 7.3.7 Current Regulation
      8. 7.3.8 PWM Dimming
    4. 7.4 Device Functional Modes
      1. 7.4.1 Protections
        1. 7.4.1.1  Switch Current Limit Protection Using the ISNS Pin
        2. 7.4.1.2  LED Open Protection
        3. 7.4.1.3  LED Short-Cross Protection Using the FBP Pin
        4. 7.4.1.4  Schottky Diode Open Protection
        5. 7.4.1.5  Schottky Diode Short Protection
        6. 7.4.1.6  IFB Overvoltage Protection During Start-up
        7. 7.4.1.7  Output Overvoltage Protection Using the OVP Pin
        8. 7.4.1.8  Output Short-to-Ground Protection
        9. 7.4.1.9  IFB Short-to-Ground Protection
        10. 7.4.1.10 ISET Short-to-Ground Protection
        11. 7.4.1.11 Thermal Protection
      2. 7.4.2 Indication For Fault Conditions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Schottky Diode
        3. 8.2.2.3 Switch MOSFET and Gate Driver Resistor
        4. 8.2.2.4 Current Sense and Current Sense Filtering
        5. 8.2.2.5 Output Capacitor
        6. 8.2.2.6 Loop Consideration
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Trademarks

PowerPAD is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.