SLVS806D April   2009  – December 2015 TPS61240 , TPS61241


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
      1. 7.6.1 Table of Graphs
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Operation
      2. 9.3.2 Current Limit Operation
      3. 9.3.3 Undervoltage Lockout
      4. 9.3.4 Input Overvoltage Protection
      5. 9.3.5 Enable
      6. 9.3.6 Soft Start
      7. 9.3.7 Load Disconnect
      8. 9.3.8 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power Save Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. Programming the Output Voltage
        2. Inductor Selection
        3. Input Capacitor
        4. Output Capacitor
        5. Checking Loop Stability
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Related Links
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Chip Scale Package Dimensions

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Layout

12.1 Layout Guidelines

As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground tracks. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.

Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC. The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the control ground, it is recommended to use short traces as well, separated from the power ground traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and control ground current.

12.2 Layout Example

TPS61240 TPS61241 layout1_lvs806.gif Figure 22. Suggested Layout (Top)

12.3 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added heat sinks, and convection surfaces, and the presence of other heat-generating components, affect the power- dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

  • Improving the power dissipation capability of the PCB design
    • For example, increase of the GND plane on the top layer which is connected to the exposed thermal pad
    • Use thicker copper layer
  • Improving the thermal coupling of the component to the PCB
  • Introducing airflow in the system

The maximum recommended junction temperature (TJ) of the TPS6124x is 105°C. The thermal resistance of the 6-pin CSP package (YFF-6) is RθJA = 133 °C/W. Regulator operation is specified to a maximum steady-state ambient temperature TA of 85°C. Therefore, the maximum power dissipation is about 150 mW.

Equation 6. PD(Max) = [TJ (max) - TA ] / θJA = [105°C - 85°C] / 133 °C/W = 150 mW