SLVSEE7B June   2018  – January 2021 TPS61372

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable and Disable
      3. 7.3.3 Error Amplifier
      4. 7.3.4 Bootstrap Voltage (BST)
      5. 7.3.5 Load Disconnect
      6. 7.3.6 Overvoltage Protection
      7. 7.3.7 Thermal Shutdown
      8. 7.3.8 Start-Up
      9. 7.3.9 Short Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation
      2. 7.4.2 Auto PFM Mode
      3. 7.4.3 Forced PWM Mode
      4. 7.4.4 Mode Selectable
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Setting the Output Voltage
        3. 8.2.2.3 Selecting the Inductor
        4. 8.2.2.4 Selecting the Output Capacitors
        5. 8.2.2.5 Selecting the Input Capacitors
        6. 8.2.2.6 Loop Stability and Compensation
          1. 8.2.2.6.1 Small Signal Model
        7. 8.2.2.7 Loop Compensation Design Steps
        8. 8.2.2.8 Selecting the Bootstrap Capacitor
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YKB|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.