SLVSH38 November   2023 TPS61377

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VCC Power Supply
      2. 7.3.2 Enable and Programmable UVLO
      3. 7.3.3 Soft Start
      4. 7.3.4 Switching Frequency
      5. 7.3.5 Programmable Inductor Peak Current Limit
      6. 7.3.6 Shut Down
      7. 7.3.7 Overvoltage Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation
      2. 7.4.2 Forced PWM Mode
      3. 7.4.3 Auto PFM Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting Output Voltage
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Bootstrap Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Output Capacitor Selection
        6. 8.2.2.6 Loop Stability
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
        1. 8.4.2.1 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2.4 Input Capacitor Selection

Multilayer ceramic capacitors are an excellent choice for the input decoupling of the step-up converter since they have extremely low ESR and are available in small footprints. Input capacitors must be located as close as possible to the device. While a 22-µF input capacitor or equivalent is sufficient for the most applications, larger values can be used to reduce input current ripple.

Take care when using only ceramic input capacitors. When a ceramic capacitor is used at the input and the power is being supplied through long wires, such as from a wall adapter, a load step at the output can induce ringing at the VIN pin. This ringing can couple to the output and be mistaken as loop instability or can even damage the device. Additional "bulk" capacitor (electrolytic or tantalum) in this circumstance, must be placed between CIN and the power source lead to reduce ringing that can occur between the inductance of the power source leads and CIN.