SLVSDU1K August   2018  – July 2025 TPS62810-Q1 , TPS62811-Q1 , TPS62812-Q1 , TPS62813-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Schematic
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Precise Enable
      2. 8.3.2 COMP/FSET
      3. 8.3.3 MODE / SYNC
      4. 8.3.4 Spread Spectrum Clocking (SSC)
      5. 8.3.5 Undervoltage Lockout (UVLO)
      6. 8.3.6 Power Good Output (PG)
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode Operation (PWM/PFM)
      3. 8.4.3 100% Duty-Cycle Operation
      4. 8.4.4 Current Limit and Short-Circuit Protection
      5. 8.4.5 Foldback Current Limit and Short-Circuit Protection
      6. 8.4.6 Output Discharge
      7. 8.4.7 Soft Start / Tracking (SS/TR)
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Programming the Output Voltage
      2. 9.1.2 External Component Selection
        1. 9.1.2.1 Inductor Selection
      3. 9.1.3 Capacitor Selection
        1. 9.1.3.1 Input Capacitor
        2. 9.1.3.2 Output Capacitor
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Fixed Output Voltage Versions
      2. 9.3.2 Voltage Tracking
      3. 9.3.3 Synchronizing to an External Clock
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS6281x-Q1 UNIT
RWY
9 PINS
RθJA Junction-to-ambient thermal resistance 71.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 37.2 °C/W
RθJB Junction-to-board thermal resistance 16.4 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 16.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.