SLVSFS3A September   2020  – December 2020 TPS62868 , TPS62869

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C InterfaceTiming Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Save Mode
      2. 8.3.2 Forced PWM Mode
      3. 8.3.3 Start-up
      4. 8.3.4 Switch Current Limit and HICCUP Short-Circuit Protection
      5. 8.3.5 Undervoltage Lockout (UVLO)
      6. 8.3.6 Thermal Warning and Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable (EN)
      2. 8.4.2 Output Discharge
      3. 8.4.3 Start-up Output Voltage and I2C Slave Address Selection (VSET)
      4. 8.4.4 Select Output Voltage Registers (VID)
      5. 8.4.5 Power Good ( PG)
    5. 8.5 Programming
      1. 8.5.1 Serial Interface Description
      2. 8.5.2 Standard-, Fast-, and Fast-Mode Plus Protocol
      3. 8.5.3 HS-Mode Protocol
      4. 8.5.4 I2C Update Sequence
      5. 8.5.5 I2C Register Reset
    6. 8.6 Register Map
      1. 8.6.1 Slave Address Byte
      2. 8.6.2 Register Address Byte
      3. 8.6.3 VOUT Register 1
      4. 8.6.4 VOUT Register 2
      5. 8.6.5 CONTROL Register
      6. 8.6.6 STATUS Register
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Setting The Output Voltage
        2. 9.2.2.2 Output Filter Design
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Support Resources
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Trademarks
    6. 12.6 Glossary
    7. 12.7 Electrostatic Discharge Caution
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • 11-mΩ and 10.5-mΩ internal power MOSFETs
  • >90% efficiency (0.9-V output)
  • DCS-Control topology for fast transient response
  • Available output voltage ranges for dynamic voltage scaling (DVS) through I2C
    • Output voltage range from 0.2-V to 0.8375-V with 2.5-mV step size
    • Output voltage range from 0.4-V to 1.675-V with 5-mV step size
    • Output voltage range from 0.8-V to 3.35-V with 10-mV step size
  • 1% output voltage accuracy
  • 2.4-MHz switching frequency
  • Selection by external resistor
    • Start-up output voltage
    • I2C slave address
  • Selection by I2C interface
    • Power save mode or forced PWM mode
    • Output discharge
    • Hiccup or latching short-circuit protection
    • Output voltage ramp speed
  • Thermal pre-warning and thermal shutdown
  • Power good indicator pin option with window comparator
  • I2C-compatible interface up to 3.4 Mbps
  • Available in 1.5-mm x 2.5-mm x 1.0-mm 9-pin QFN package with 0.5-mm pitch
  • Also available in WCSP package: TPS62866, 6-A synchronous step-down converter with I2C interface in 1.05-mm x 1.78-mm WCSP package
  • Create a custom design using with TPS62868/9 with the WEBENCH® Power Designer