SLVSB76B August   2012  – August 2019 TPS63036

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Enable
      2. 7.3.2 Overvoltage Protection
      3. 7.3.3 Undervoltage Lockout
      4. 7.3.4 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Soft-Start and Short Circuit Protection
      2. 7.4.2 Buck-Boost Operation
      3. 7.4.3 Control Loop
      4. 7.4.4 Power-Save Mode and Synchronization
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Capacitor Selection
          1. 8.2.2.2.1 Input Capacitor
          2. 8.2.2.2.2 Output Capacitor
        3. 8.2.2.3 Setting the Output Voltage
        4. 8.2.2.4 Current Limit
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2.2.2 Output Capacitor

For the output capacitor, use of a small ceramic capacitors placed as close as possible to the VOUT and GND pins of the IC is recommended. If, for any reason, the application requires the use of large capacitors which can not be placed close to the IC, use a smaller ceramic capacitor in parallel to the large capacitor. The small capacitor should be placed as close as possible to the VOUT and GND pins of the IC. The recommended typical output capacitor value is 30 µF.

There is also no upper limit for the output capacitance value. Larger capacitors will cause lower output voltage ripple as well as lower output voltage drop during load transients.

When choosing input and output capacitors, it needs to be kept in mind, that the value of capacitance experiences significant losses from their rated value depending on the operating temperature and the operating DC voltage. It is not uncommon for a small surface mount ceramic capacitor to lose 50% and more of its rated capacitance. For this reason it could be important to use a larger value of capacitance or a capacitor with higher voltage rating in order to ensure the required capacitance at the full operating voltage.