SLVSB76B August 2012 – August 2019 TPS63036
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
The maximum recommended junction temperature (TJ) of the TPS63036 device is 125°C. The thermal resistance of this 8-pin chip-scale package (YFG) is RθJA = 84°C/W, if all pins are soldered. Specified regulator operation is assured to a maximum ambient temperature TA of 85°C. Therefore, the maximum power dissipation is about 476 mW, as calculated in Equation 9. More power can be dissipated if the maximum ambient temperature of the application is lower.