SLVSBD1B December   2012  – August 2025 TPS65175

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configurations
  6. Ordering Information #GUID-A66BA10C-7D19-4133-842F-4CC0C2AD52C6/SLVSAP8211
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Thermal Information
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics
    5. 6.5 I2C Interface Timing Characteristics #GUID-79B32470-0E13-4B06-925C-21E3D7AB5A31/SLVSAE57133
    6. 6.6 I2C Timing Diagrams
    7.     14
    8.     15
    9.     16
    10. 6.7 Typical Characteristics
  8. DAC Range Summary
    1.     19
    2. 7.1 Sequencing
    3. 7.2 Power-Up
    4. 7.3 Power-Down
  9. Detailed Description
    1. 8.1  Boost Converter (VDD)
      1. 8.1.1 Enable Signal (DLY2)
      2. 8.1.2 Boost Converter Operation
      3. 8.1.3 Startup (Boost Converter)
      4. 8.1.4 Protections (Boost Converter)
      5. 8.1.5 Setting the Output Voltage VDD
    2. 8.2  Boost Converter Design Procedure
      1. 8.2.1 Inductor Selection (Boost Converter)
      2. 8.2.2 Rectifier Diode Selection (Boost Converter)
      3. 8.2.3 Compensation (COMP)
      4. 8.2.4 Input Capacitor Selection
      5. 8.2.5 Output Capacitor Selection
      6. 8.2.6 DCM Mode
    3. 8.3  Buck Converter (VCC)
      1. 8.3.1 Enable Signal (UVLO)
      2. 8.3.2 Buck converter Operation
      3. 8.3.3 Startup and Short Circuit Protection (Buck Converter)
      4. 8.3.4 Setting the Output Voltage VCC
    4. 8.4  Buck Converter Design Procedure
      1. 8.4.1 Inductor Selection (Buck Converter)
      2. 8.4.2 Rectifier Diode Selection (Buck Converter)
      3. 8.4.3 Input Capacitor Selection (Buck Converter)
      4. 8.4.4 Output Capacitor Selection (Buck Converter)
      5. 8.4.5 DCM Mode
    5. 8.5  Synchronous Buck Converter (HVDD)
      1. 8.5.1 Enable Signal (DLY2)
      2. 8.5.2 Startup and Short Circuit Protection (Synchronous Buck Converter)
      3. 8.5.3 Setting the output voltage HVDD
    6. 8.6  Synchronous Buck Converter Design Procedure
      1. 8.6.1 Inductor Selection (Synchronous Buck Converter)
      2. 8.6.2 Input Capacitor Selection
      3. 8.6.3 Output Capacitor Selection
    7. 8.7  Positive Charge Pump Controller (VGH) and Temperature Compensation
      1. 8.7.1 Enable Signal (DLY3)
      2. 8.7.2 Positive Charge Pump Controller Operation
    8. 8.8  Positive Charge Pump Design Procedure
      1. 8.8.1 Diodes selection (CPP)
      2. 8.8.2 Capacitors Selection (CPP)
      3. 8.8.3 Selecting the PNP Transistor (CPP)
      4. 8.8.4 Positive Charge Pump Protection
    9. 8.9  VGH Temperature Compensation
      1. 8.9.1 Setting the output voltage VGH_LT and VGH_HT
    10. 8.10 Negative Charge Pump (VGL)
      1. 8.10.1 Enable Signal (DLY1)
      2. 8.10.2 Setting the output voltage VGL
    11. 8.11 Negative Charge Pump Design Procedure
      1. 8.11.1 Diodes Selection (CPN)
      2. 8.11.2 Capacitors selection (CPN)
      3. 8.11.3 Selecting the NPN Transistor (CPN)
      4. 8.11.4 Negative Charge Pump Protection
    12. 8.12 P-Vcom Voltage and Gain (VCOM)
      1. 8.12.1 Enable Signal (DLY2)
    13. 8.13 P-Vcom Design Procedure
      1. 8.13.1 Setting the P-Vcom gain
    14. 8.14 P-Vcom Temperature Compensation
      1. 8.14.1 Setting the VCOM output voltage
    15. 8.15 Gamma Buffer (GMA1-GMA6)
      1. 8.15.1 Enable Signal (DLY2)
      2. 8.15.2 Setting the output voltage of GMA1-GMA6
      3. 8.15.3 Output Load (Gamma Buffer)
    16. 8.16 Level Shifters
    17. 8.17 State Machine
    18. 8.18 GCLK
    19. 8.19 MCLK
    20. 8.20 GST
    21. 8.21 E/O
    22. 8.22 Reverse
    23. 8.23 VGH_F and VGH_R
    24. 8.24 VST
    25. 8.25 RESET
    26. 8.26 EVEN and ODD
    27. 8.27 Abnormal Operation
    28. 8.28 CLK1 to CLK6
    29. 8.29 Gate Voltage Shaping
    30. 8.30 Power Supply Sequencing (CLK1-CLK6, VST, RESET)
    31. 8.31 Power Supply Sequencing (EVEN, ODD)
    32. 8.32 Power Supply Sequencing (VGH_F, VGH_R)
    33.     101
    34. 8.33 Typical Applications
  10. APPENDIX – I2C INTERFACE
    1. 9.1 I2C Serial Interface Description
  11. 10Detailed Description
    1. 10.1 DAC Settings
    2. 10.2 I2C Interface Protocol
    3. 10.3 Temperature Compensation
    4. 10.4 PCB Layout Recommendations
  12. 11Register Map
  13. 12DAC Registers
  14. 13Electrostatic Discharge Caution
  15. 14Revision History
  16. 15Mechanical, Packaging, and Orderable Information
    1. 15.1 Package Option Addendum
      1. 15.1.1 Packaging Information
      2. 15.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

Electrical Characteristics

AVIN = PVINB = PVINH = 12V, VDD = 16V, HVDD = 8V , VCC = 3.3V for TPS65175 / VCC = 1.8V for TPS65175A , VGH_LT = 30V, VGH_HT = 28V, VGL = –5V, VCOM = 7.5V, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted). Values in bold are guaranteed through test, design or correlations.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
POWER SUPPLY
VINInput voltage range8.614.7V
IQ_AVINSupply quiescent current AVINDevice not switching2.04.0mA
IQ_PVINBSupply quiescent current PVINBDevice not switching0.11.0mA
IQ_PVINHSupply quiescent current PVINHDevice not switching1.52.5mA
IQ_SWISupply quiescent current SWIDevice not switching7.312mA
IQ_VGHSupply quiescent current VGHE/O, GCLK, GST, MCLK, REVERSE = 0 V0.40.6mA
IQ_VGH_E/OSupply quiescent current VGH_E/OE/O, GCLK, GST, MCLK, REVERSE = 0 V0.060.1mA
IQ_VGLNegative supply currentE/O, GCLK, GST, MCLK, REVERSE = 0 V0.130.25mA
LCD BIAS MISCELLANEOUS
VUVLOUndervoltage lockoutAVIN rising8.38.68.9V
Undervoltage lockout hysteresis0.30.81.3V
TSDThermal shutdownTJ rising130138150°C
THYSThermal shutdown hysteresisTJ falling8.5910
LOGIC SIGNAL SCL, SDA
VIHHigh level input voltage SCL, SDAInput rising, AVIN = 8.6 V to 14.7 V0.65*VCCV
VILLow level input voltage SCL, SDAInput falling, AVIN = 8.6 V to 14.7 V0.3 x VCC
INTERNAL OSCILLATOR
fOSCLow switching frequency for the boost, the buck converter and the charge pumps600750900kHz
High switching frequency for the boost and the buck converter1.21.51.8MHz
INTERNAL REGULATOR
VL(2)Internal regulatorNo load4.85.05.2V
5 mA current
BOOST CONVERTER [VDD]
VDD_ACCOutput voltage accuracyVDD default value–2%162%V
rDS(on)N-MOSFET on-resistance - TPS65175ISW = current limit90165
N-MOSFET on-resistance - TPS65175A100179
ILIMN-MOSFET current limit3.54.35.2A
ISSSoft-start currentVSS = 1.230 V71013µA
Line regulationAVIN = 8.6 V to 14.7 V, IOUT = 700 mA0.002%/V
Load regulationIOUT = 0 A to 1 A0.066%/A
ISOLATION SWITCH
rDS(on)ISOIsolation MOSFET on-resistanceISWI = 1 A100180
ISC_ISOShort circuit current limitVSWI = 12 V, VSWO = 0 V100200300mA
BUCK CONVERTER [VCC]
VCC_ACCOutput voltage accuracyVCC default value TPS65175–3%3.33%V
VCC default value TPS65175A–3%1.83%V
rDS(on)Switch on-resistanceISWB = current limit180300
ILIMSwitch current limit2.63.44.2A
Line regulationVIN = AVIN = PVINB = 8.6 V to 14.7 V
ICC = 200 mA
0.001%/V
Load regulationICC = 0 A to 800 mA0.033%/A
SYNCHRONOUS BUCK CONVERTER [HVDD]
HVDD_ACCOutput voltage accuracyHVDD default value–2%82%V
rDS(on)MOSFET on-resistanceISBW3 = current limit320480
ILIMSwitch current limit – source0.91.31.7A
Switch current limit – sink–0.9–1.3–1.7
fSWHSwitching frequency synchronous buck converter1.21.51.8MHz
Line regulationAVIN = PVINH = 8.6 V to 14.7 V
IOUT = ±300 mA
0.003%/V
Load regulationIOUT = –500 mA to 500 mA0.007%/A
POSITIVE CHARGE PUMP CONTROLLER [VGH]
VGH_LT_ACCOutput voltage accuracyVGH_LT default value–3%303%V
VGH_HT_ACCVGH_HT default value–3%283%
ICTRLP_SCBase current during short circuitVGH = GND405575µA
ICTRLP_maxMaximum base current11.62mA
Line regulationAVIN = 8.6 V to 14.7 V, IGH = 50 mA0.004%/V
Load regulationIGH = 0 A to 100 mA0.414%/A
NEGATIVE CHARGE PUMP CONTROLLER [VGL]
VGLOutput voltage accuracyVGL default value–3%–53%V
ICTRLN_SCBase current during short circuitVGL = GND200320440µA
ICTRLN_maxMaximum base current11.63mA
Line regulationAVIN = 8.6 V to 14.7 V, IGL = 50 mA0.001%/V
Load regulationIGL = 0 A to 100 mA0.817%/A
GAMMA BUFFER [GMA]
IOContinuous output current1030mA
VOH1Output voltage swing high GMA1,2,3IOUT = 10mAVDD–0.7VDD–0.5V
VOL1Output voltage swing low GMA1,2,3IOUT = 10mAHVDD+0.5HVDD+0.7
VOH2Output voltage swing high GMA4,5,6IOUT = 10mAHVDD–0.7HVDD–0.5V
VOL2Output voltage swing low GMA4,5,6IOUT = 10mA0.50.7
INL_maxMaximum integral nonlinearity±0.6LSB
DNL_maxMaximum differential nonlinearity±0.3LSB
RESET GENERATOR [ RST](1)
VRST(ON)Low voltage levelIRST(ON) = 1 mA0.4V
ILEAK_ RSTLeakage currentVRST(ON) = VCC = 3.3 V2µA
P-VCOM [VCOM]
VCOMOutput voltage accuracyVCOM default value–2%7.52%V
BWUnity gain -3dB bandwidthVCM = 7.5 V, VIN = 63 mVpp557595MHz
AVOLOpen loop gainVCM = 7.5 V100120140dB
CMRRCommon-Mode Rejection RatioVCM = 7.5 V95110125dB
PSRRPower Supply Rejection RatioVCM = 7.5 V, VDD = 12.7 V to 19 V80110140dB
SRSlew rate risingUnity gain, VCOM_FB = 7.5 V ± 2 VPP234580V/µs
Slew rate falling254580
rDS(on)High-side output resistanceIOUT = 10 mA, sourcing, VCOM = 9.5 V, VNEG = 7.5 V2040Ω
Low-side output resistanceIOUT = 10 mA, sinking, VCOM = 7.5 V, VNEG = 9.5 V210
IPKPeak output current sourcingUnity gain, VCOM = GND400550mA
Peak output current sinkingUnity gain, VCOM = SWO400550
LEVEL SHIFTERS MISCELLANEOUS
UVLOUndervoltage lockout risingVGH rising5.09.211V
Undervoltage lockout fallingVGH falling2.03.55.0
LEVEL SHIFTERS INPUT SIGNALS (E/O, GCLK, GST, MCLK, REVERSE)
VIHHigh level input voltage E/O, GCLK, GST, MCLK, REVERSEVGH = 17 V to 34 V, TA = 25°C ~ 85°C1.25V
VGH = 17 V to 34 V, TA = -40°C ~ 85°C1.30V
VILLow level input voltage E/O, GCLK, GST, MCLK, REVERSEVGH = 17 V to 34 V0.75V
IINInput currentE/O, GCLK, GST, MCLK = 0 V±100nA
E/O, GCLK, GST, MCLK = 3.3 V±100
REVERSE = 3.3 V243344µA
RPULL-DOWNREVERSE pin internal pull-down resistor75100135
LEVEL SHIFTERS OUTPUTS (CLK1 to CLK6)
rDS(on)High side ON resistanceIOUT = 10 mA, sourcing (high side)1230Ω
Low side ON resistanceIOUT = 10 mA, sinking (low side)715
tPLHGCLK rising edge propagation delayGCLK rising edge to CLK rising edge, COUT = 300 pF50100ns
tPHLMCLK falling edge propagation delayMCLK falling edge to CLK falling edge, COUT = 300 pF50100ns
LEVEL SHIFTERS OUTPUTS (EVEN, ODD, RESET, VGH_F, VGH_R, VST)
rDS(on)High side ON resistanceIOUT = 10 mA, sourcing (high side)3580Ω
Low side ON resistanceIOUT = 10 mA, sinking (low side)1640
tPLHGST rising edge propagation delayGST rising edge to VST rising edge, COUT = 300 pF60120ns
GST rising edge to RESET rising edge, COUT = 300 pF60120
tPHLGST falling edge propagation delayGST falling edge to VST falling edge, COUT = 300 pF60120ns
GST falling edge to RESET falling edge, COUT = 300 pF60120
tPLHE/O rising edge propagation delayE/O rising edge to ODD falling edge, COUT = 300 pF60120ns
E/O rising edge to EVEN falling edge, COUT = 300 pF60120
tPHLE/O falling edge propagation delayE/O falling edge to ODD rising edge, COUT = 300 pF60120ns
E/O falling edge to EVEN rising edge, COUT = 300 pF60120
tSUE/O set-up time during abnormal operationE/O to GST rising edge530ns
tPLHREVERSE rising edge propagation delayREVERSE rising edge to VGH_F falling edge, COUT = 300 pF60120ns
tPHLGST rising edge propagation delayGST rising edge to VGH_R falling edge, COUT = 300 pF60120ns
t12REVERSE dead timeVGH_F falling edge to VGH_R rising edge, COUT = 300 pF205001000ns
t13VGH_R falling edge to VGH_F rising edge, COUT = 300 pF205001000
GATE VOLTAGE SHAPING (RE)
rDS(on)Gate shaping resistanceMeasured between active CLK channel and RE at 10 mA70140Ω
tPHLMCLK rising edge propagation delayMCLK rising edge to CLK falling edge, COUT = 300 pF65100ns
ILEAKGate shaping leakage currentMeasured between RE and GND-1010µA
External pull-up resistor to be chosen so that the current flowing into RST pin when active (VRST = 0 V) is below IRST(ON) = 1 mA.
The VL regulator can supply 5 mA externally