SWCS032F October   2008  – July 2014 TPS65950

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Corner Balls
    2. 3.2 Ball Characteristics
    3. 3.3 Signal Description
  4. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Handling Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Digital I/O Electrical Characteristics
    5. 4.5 Thermal Resistance Characteristics for ZXN Package
    6. 4.6 Minimum Voltages and Associated Currents
    7. 4.7 Timing Requirements and Switching Characteristics
      1. 4.7.1 Timing Parameters
      2. 4.7.2 Target Frequencies
      3. 4.7.3 I2C Timing
      4. 4.7.4 Audio Interface: TDM/I2S Protocol
        1. 4.7.4.1 I2S Right- and Left-Justified Data Format
        2. 4.7.4.2 TDM Data Format
      5. 4.7.5 Voice/Bluetooth PCM Interfaces
      6. 4.7.6 JTAG Interfaces
  5. 5Detailed Description
    1. 5.1  Power Module
      1. 5.1.1 Power Providers
        1. 5.1.1.1  VDD1 DC-DC Regulator
          1. 5.1.1.1.1 VDD1 DC-DC Regulator Characteristics
          2. 5.1.1.1.2 External Components and Application Schematic
        2. 5.1.1.2  VDD2 DC-DC Regulator
          1. 5.1.1.2.1 VDD2 DC-DC Regulator Characteristics
          2. 5.1.1.2.2 External Components and Application Schematic
        3. 5.1.1.3  VIO DC-DC Regulator
          1. 5.1.1.3.1 VIO DC-DC Regulator Characteristics
          2. 5.1.1.3.2 External Components and Application Schematic
        4. 5.1.1.4  VDAC LDO Regulator
        5. 5.1.1.5  VPLL1 LDO Regulator
        6. 5.1.1.6  VPLL2 LDO Regulator
        7. 5.1.1.7  VMMC1 LDO Regulator
        8. 5.1.1.8  VMMC2 LDO Regulator
        9. 5.1.1.9  VSIM LDO Regulator
        10. 5.1.1.10 VAUX1 LDO Regulator
        11. 5.1.1.11 VAUX2 LDO Regulator
        12. 5.1.1.12 VAUX3 LDO Regulator
        13. 5.1.1.13 VAUX4 LDO Regulator
        14. 5.1.1.14 Internal LDOs
        15. 5.1.1.15 CP
        16. 5.1.1.16 USB LDO Short-Circuit Protection Scheme
      2. 5.1.2 Power References
      3. 5.1.3 Power Control
        1. 5.1.3.1 Backup Battery Charger
        2. 5.1.3.2 Battery Monitoring and Threshold Detection
          1. 5.1.3.2.1 Power On/Power Off and Backup Conditions
        3. 5.1.3.3 VRRTC LDO Regulator
      4. 5.1.4 Power Consumption
      5. 5.1.5 Power Management
        1. 5.1.5.1 Boot Modes
        2. 5.1.5.2 Process Modes
          1. 5.1.5.2.1 C027.0 Mode
          2. 5.1.5.2.2 C021.M Mode
        3. 5.1.5.3 Power-On Sequence
          1. 5.1.5.3.1 Timings Before Sequence_Start
          2. 5.1.5.3.2 OMAP2 Power-On Sequence
          3. 5.1.5.3.3 OMAP3 Power-On Sequence
          4. 5.1.5.3.4 Power On in Slave_C021_Generic Mode
        4. 5.1.5.4 Power-Off Sequence
          1. 5.1.5.4.1 Power-Off Sequence in Master Modes
    2. 5.2  Real-Time Clock and Embedded Power Controller
      1. 5.2.1 RTC
        1. 5.2.1.1 Backup Battery
      2. 5.2.2 EPC
    3. 5.3  Audio/Voice Module
      1. 5.3.1 Audio/Voice Downlink (RX) Module
        1. 5.3.1.1  Earphone Output
          1. 5.3.1.1.1 Earphone Output Characteristics
          2. 5.3.1.1.2 External Components and Application Schematic
        2. 5.3.1.2  8-Ω Stereo Hands-Free
          1. 5.3.1.2.1 8-Ω Stereo Hands-Free Output Characteristics
            1. 5.3.1.2.1.1 Short-Circuit Protection
          2. 5.3.1.2.2 External Components and Application Schematic
        3. 5.3.1.3  Headset
          1. 5.3.1.3.1 Headset Output Characteristics
          2. 5.3.1.3.2 External Components and Application Schematic
        4. 5.3.1.4  Headset Pop-Noise Attenuation
        5. 5.3.1.5  Predriver for External Class-D Amplifier
          1. 5.3.1.5.1 Predriver Output Characteristics
          2. 5.3.1.5.2 External Components and Application Schematic
        6. 5.3.1.6  Vibrator H-Bridge
          1. 5.3.1.6.1 Vibrator H-Bridge Output Characteristics
          2. 5.3.1.6.2 External Components and Application Schematic
        7. 5.3.1.7  Carkit Output
        8. 5.3.1.8  Digital Audio Filter Module
        9. 5.3.1.9  Digital Voice Filter Module
          1. 5.3.1.9.1 Voice Downlink Filter (Sampling Frequency at 8 kHz)
          2. 5.3.1.9.2 Voice Downlink Filter (Sampling Frequency at 16 kHz)
        10. 5.3.1.10 Boost Stage
      2. 5.3.2 Audio/Voice Uplink (TX) Module
        1. 5.3.2.1  Microphone Bias Module
          1. 5.3.2.1.1 Analog Microphone Bias Module Characteristics
          2. 5.3.2.1.2 External Components and Application Schematic
          3. 5.3.2.1.3 Digital Microphone Bias Module Characteristics
          4. 5.3.2.1.4 Silicon Microphone Characteristics
        2. 5.3.2.2  Stereo Differential Input
        3. 5.3.2.3  Headset Differential Input
        4. 5.3.2.4  FM Radio/Auxiliary Stereo Input
          1. 5.3.2.4.1 External Components
        5. 5.3.2.5  PDM Interface for Digital Microphones
        6. 5.3.2.6  Uplink Characteristics
        7. 5.3.2.7  Microphone Amplification Stage
        8. 5.3.2.8  Carkit Input
        9. 5.3.2.9  Digital Audio Filter Module
        10. 5.3.2.10 Digital Voice Filter Module
          1. 5.3.2.10.1 Voice Uplink Filter (Sampling Frequency at 8 kHz)
          2. 5.3.2.10.2 Voice Uplink Filter (Sampling Frequency at 16 kHz)
    4. 5.4  USB HS 2.0 OTG Transceiver
      1. 5.4.1 USB Features
      2. 5.4.2 USB Transceiver
        1. 5.4.2.1 MCPC Carkit Port Timing
        2. 5.4.2.2 USB-CEA Carkit Port Timing
        3. 5.4.2.3 HS USB Port Timing
        4. 5.4.2.4 PHY Electrical Characteristics
          1. 5.4.2.4.1  5-V Tolerance
          2. 5.4.2.4.2  LS/FS Single-Ended Receivers
          3. 5.4.2.4.3  LS/FS Differential Receiver
          4. 5.4.2.4.4  LS/FS Differential Transmitter
          5. 5.4.2.4.5  HS Differential Receiver
          6. 5.4.2.4.6  HS Differential Transmitter
          7. 5.4.2.4.7  CEA/MCPC/UART Driver
          8. 5.4.2.4.8  Pullup/Pulldown Resistors
          9. 5.4.2.4.9  PHY DPLL Electrical Characteristics
          10. 5.4.2.4.10 PHY Power Consumption
        5. 5.4.2.5 OTG Electrical Characteristics
          1. 5.4.2.5.1 OTG VBUS Electrical
          2. 5.4.2.5.2 OTG ID Electrical
    5. 5.5  Battery Interface
      1. 5.5.1 General Description
        1. 5.5.1.1 Battery Charger Interface Overview
        2. 5.5.1.2 Battery Backup Overview
      2. 5.5.2 Typical Application Schematics
        1. 5.5.2.1 Functional Configurations
        2. 5.5.2.2 In-Rush Current Limitation Schematic
        3. 5.5.2.3 Configuration With BCI Not Used
      3. 5.5.3 Electrical Characteristics
        1. 5.5.3.1 Main Charge
        2. 5.5.3.2 Precharge
        3. 5.5.3.3 Constant Voltage Mode
      4. 5.5.4 Charge Sequence Timing Diagram
      5. 5.5.5 CEA Charger Type
    6. 5.6  MADC
      1. 5.6.1 General Description
      2. 5.6.2 Main Electrical Characteristics
      3. 5.6.3 Channel Voltage Input Range
        1. 5.6.3.1 Sequence Conversion Time (Real-Time or Nonaborted Asynchronous)
    7. 5.7  LED Drivers
      1. 5.7.1 General Description
    8. 5.8  Keyboard
      1. 5.8.1 Keyboard Connection
    9. 5.9  Clock Specifications
      1. 5.9.1 Features
      2. 5.9.2 Input Clock Specifications
        1. 5.9.2.1 Clock Source Requirements
        2. 5.9.2.2 High-Frequency Input Clock
        3. 5.9.2.3 32-kHz Input Clock
          1. 5.9.2.3.1 External Crystal Description
          2. 5.9.2.3.2 External Clock Description
      3. 5.9.3 Output Clock Specifications
        1. 5.9.3.1 32KCLKOUT Output Clock
        2. 5.9.3.2 HFCLKOUT Output Clock
        3. 5.9.3.3 Output Clock Stabilization Time
    10. 5.10 Debouncing Time
    11. 5.11 External Components
  6. 6Device and Documentation Support
    1. 6.1 Device Support
      1. 6.1.1 Development Support
      2. 6.1.2 Device Nomenclature
    2. 6.2 Documentation Support
    3. 6.3 Community Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Export Control Notice
    7. 6.7 Glossary
    8. 6.8 Additional Acronyms

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZXN|209
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Device and Documentation Support

6.1 Device Support

6.1.1 Development Support

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE).

The following products support development of the TPS65950 device applications:

Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target software needed to support any TPS65950 device application.

Hardware Development Tools: Extended Development System (XDS™) Emulator

6.1.2 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, TPS65950). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    PPrototype (X), preproduction (P), or qualified/production device (blank). A blank in the symbol or part number is collapsed so there are no gaps between characters.
    A Mask set version descriptor (initial silicon = blank, first silicon revision = A, second silicon revision = B, ...). Initial silicon version is ES1.0; first revision can be named ES2.0, ES1.1, or ES1.01, depending on the level of change. Note: Device name is a maximum of 10 characters.
    YMYear month
    LLLLSLot code
    $Fab planning code

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, ZXN) and the temperature range (for example, blank is the default commercial temperature range).

For orderable part numbers of TPS65950 devices in the ZXN package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

swcs032-001.gifFigure 6-1 Device Nomenclature

6.2 Documentation Support

The following documents describe the TPS65950 device. Copies of these documents are available on the Internet at www.ti.com.

6.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

6.4 Trademarks

SmartReflex, OMAP, E2E are trademarks of Texas Instruments.

Bluetooth is a registered trademark of Bluetooth SIG, Inc.

6.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

6.6 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

6.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

6.8 Additional Acronyms

Additional acronyms used in this data sheet are described below.

ADC Analog-to-digital converter
ALC Automatic level control
ARIB Association of Radio Industries and Businesses
ASIC Application-specific integrated circuit
BCI Battery charger interface
BGA Ball grid array
BT Bluetooth
BW Signal bandwidth
CMOS Complementary metal oxide semiconductor
Codec Coder/decoder
CMT Cellular mobile telephone
CPU Central processing unit
DAC Digital-to-analog converter
DBB Digital baseband
DCR Direct current (dc) resistance
DM Data manual
DSP Digital signal processor
DVFS Dynamic voltage and frequency scaling
ESD Electrostatic discharge
ESR Equivalent series resistance
FET Field effect transistor
FSR Full-scale range
GP General-purpose
GPIO General-purpose input/output
hiZ High impedance
HS High speed or high security
HW Hardware
I2C Inter-integrated circuit
I2S Inter-IC sound
IC Integrated circuit
ICN Idle channel noise
ID Identification
IDDQ Direct drain quiescent current
IF Interface
IO or I/O Input/output
JTAG Joint Test Action Group, IEEE 1149.1 standard
LED Light emitting diode
LDO Low-dropout regulator
LJF Left-justified format
LS Low speed
MADC Monitoring analog-to-digital converter
MCPC Mobile Computing Promotion Consortium
MEMS Micro-electrical-mechanical system
NA, N/A Not applicable
NRZI Nonreturn to zero inverted
OCP Open-core protocol
OTG On-the-go
PBGA Plastic ball grid array
PCB Printed circuit board
PCM Pulse-code modulation
PD Pulldown
PDM Pulse density modulated
PFM Pulse frequency modulation
PLL Phase-locked loop
PMOS Portable media operating system
POL Polarity
POR Power-on reset
PSRR Power supply ripple rejection
PU Pullup
PWL Pulse-width length
PWT Pulse-width time
PWM Pulse-width modulation
RFID Radio frequency identification
RJF Right-justified format
RTC Real-time clock
RX Receive
SDI Serial display Interface
SMPS Switch-mode power supply
SNR Signal-to-noise ratio
SRP Secure remote password
SW Software
SYNC/SYNCHRO Synchronization
SYS System
TAP Test access port
TBD To be defined
TDM Time division multiplexing
THRU Feed through
TRM Technical reference manual
TX Transmit
UART Universal asynchronous receiver/transmitter
ULPI UTMI+ low pin interface
UPR Uninterrupted power rail
USB Universal serial bus
UTMI USB transceiver macrocell interface