SBVS087M June   2008  – June 2018 TPS735

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application
  4. 4 Revision History
    1.     Pin Configuration and Functions
      1.      Pin Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Internal Current Limit
      2. 6.3.2 Shutdown
      3. 6.3.3 Dropout Voltage
      4. 6.3.4 Start-Up and Noise Reduction Capacitor
      5. 6.3.5 Transient Response
      6. 6.3.6 Undervoltage Lockout
      7. 6.3.7 Minimum Load
      8. 6.3.8 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Input and Output Capacitor Requirements
        2. 7.2.1.2 Feed-Forward Capacitor Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Output Noise
      3. 7.2.3 Application Curves
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
    2. 9.2 Layout Example
    3. 9.3 Power Dissipation
    4. 9.4 Estimating Junction Temperature
    5. 9.5 Package Mounting
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Evaluation Modules
      2. 10.1.2 Device Nomenclature
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.