SGLS326D April   2006  – August 2025 TPS73601-EP , TPS73615-EP , TPS73618-EP , TPS73625-EP , TPS73630-EP , TPS73632-EP , TPS73633-EP

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Power Dissipation Ratings
    3. 5.3 Electrical Characteristics
    4. 5.4 Typical Characteristics
  7. Functional Block Diagrams
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1  Input and Output Capacitor Requirements
      2. 7.1.2  Output Noise
      3. 7.1.3  Board Layout Recommendation to Improve PSRR and Noise Performance
      4. 7.1.4  Internal Current Limit
      5. 7.1.5  Shutdown
      6. 7.1.6  Dropout Voltage
      7. 7.1.7  Transient Response
      8. 7.1.8  Reverse Current
      9. 7.1.9  Thermal Protection
      10. 7.1.10 Power Dissipation
      11. 7.1.11 Package Mounting
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

over operating temperature range (TA = –55°C to 125°C), VIN = VOUT(nom) + 0.5 V(1), IOUT = 10 mA, VEN = 1.7 V, and
COUT = 0.1 μF (unless otherwise noted). Typical values are at TJ = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range(1)(4) 1.7 5.5 V
VFB Internal reference (TPS73601) TJ = 25°C 1.198 1.2 1.21 V
VOUT Output voltage range (TPS73601) VFB 5.5 – VDO V
Accuracy(1) Nominal TJ = 25°C –0.5% 0.5%
Over VIN, IOUT,
and T
VOUT + 0.5 V ≤ VIN ≤ 5.5 V,
10 mA ≤ IOUT ≤ 400 mA
–1% ±0.5% 1%
ΔVOUT%/ΔVIN Line regulation(1) VO(nom) + 0.5 V ≤ VIN ≤ 5.5 V 0.01 %/V
ΔVOUT%/ΔIOUT Load regulation 1 mA ≤ IOUT ≤ 400 mA 0.002 %/mA
10 mA ≤ IOUT ≤ 400 mA 0.0005
VDO Dropout voltage(2)
(VIN = VOUT(nom) – 0.1 V)
IOUT = 400 mA 75 200 mV
ZO(DO) Output impedance in dropout 1.7 V ≤ VIN ≤ VOUT + VDO 0.25
ICL Output current limit VOUT = 0.9 × VOUT(nom) 400 650 800 mA
ISC Short-circuit current VOUT = 0 V 450 mA
IREV Reverse leakage current(3) (–IIN) VEN ≤ 0.5 V, 0 V ≤ VIN ≤ VOUT 0.1 15 μA
IGND Ground-pin current IOUT = 10 mA (IQ) 400 550 μA
IOUT = 400 mA 800 1000
ISHDN Shutdown current (IGND) VEN ≤ 0.5 V, VOUT ≤ VIN ≤ 5.5 V 0.02 1 μA
IFB FB pin current (TPS73601) 0.1 0.45 μA
PSRR Power-supply rejection ratio (ripple rejection) f = 100 Hz, IOUT = 400 mA 58 dB
f = 10 kHz, IOUT = 400 mA 37
VN Output noise voltage
BW = 10 Hz to 100 kHz
COUT = 10 μF, No CNR 27 × VOUT μVRMS
COUT = 10 μF, CNR = 0.01 μF 8.5 × VOUT
tSTR Startup time VOUT = 3 V, RL = 30 Ω, COUT = 1 μF, CNR = 0.01 μF 600 μs
VEN(HI) Enable high (enabled) 1.7 VIN V
VEN(LO) Enable low (shutdown) 0 0.5 V
IEN(HI) Enable pin current (enabled) VEN = 5.5 V 0.02 0.1 μA
TSD Thermal shutdown temperature Shutdown, temperature increasing 160 °C
Reset, temperature decreasing 140
TA Operating ambient temperature -55 125 °C
Minimum VIN = VOUT + VDO or 1.7 V, whichever is greater.
VDO is not measured for the TPS73615 (VOUT(nom) = 1.5 V) since minimum VIN = 1.7 V.
See the Application and Implementation section for more information.
For VOUT(nom) < 1.6 V, when VIN ≤ 1.6 V, the output locks to VIN and may result in a damaging over-voltage level on the output. To avoid this situation, disable the device before powering down the VIN.