SLVSBL0F December   2012  – December 2017 TPS7A66-Q1 , TPS7A69-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Hardware-Enable Option
      2.      Input-Voltage-Sensing Option
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Regulated Output (VOUT)
      3. 7.3.3 Power-On Reset (PG)
      4. 7.3.4 Reset Delay Timer (CT)
      5. 7.3.5 Sense Comparator (SI and SO for TPS7A69-Q1)
      6. 7.3.6 Adjustable Output Voltage (FB for TPS7A6601-Q1)
      7. 7.3.7 Undervoltage Shutdown
      8. 7.3.8 Low-Voltage Tracking
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Regulation
      2. 7.4.2 Disabled
      3. 7.4.3 Operation With V(VinUVLO)< VIN < VIN(min)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS7A66-Q1 Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Input Capacitor
          2. 8.2.1.2.2 Output Capacitor
        3. 8.2.1.3 Application Curve
      2. 8.2.2 TPS7A69-Q1 Typical Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Low-Voltage Tracking Threshold
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Package Mounting
      2. 10.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
    2. 10.2 Layout Examples
    3. 10.3 Power Dissipation and Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS7A66-Q1 TPS7A69-Q1 UNIT
HVSSOP
(8 PINS)		 SOIC (8 PINS)
RθJA Junction-to-ambient thermal resistance 63.4 113.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 53.0 59.6 °C/W
RθJB Junction-to-board thermal resistance 37.4 59.57 °C/W
ψJT Junction-to-top characterization parameter 3.7 12.8 °C/W
ψJB Junction-to-board characterization parameter 37.1 52.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 13.5 NA °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.