SBVS402 April   2020 TPS7B81

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
      2.      Quiescent Current vs Ambient Temperature (VOUT = 3.3 V)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Enable (EN)
      2. 7.3.2 Undervoltage Shutdown
      3. 7.3.3 Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN Lower Than 3 V
      2. 7.4.2 Operation With VIN Larger Than 3 V
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Power Dissipation
        1. 8.1.1.1 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor
        2. 8.2.2.2 Output Capacitor
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DGN Package
8-Pin HVSSOP PowerPAD™
Top View
DRV Package
6-Pin WSON PowerPAD™
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
DGN DRV
DNC — 5 — Do not connect to a biased voltage. Tie this pin to ground or leave floating.
EN 2 2 I Enable input pin. Drive EN greater than VIH to turn on the regulator. Drive EN less than VIL to put the low-dropout (LDO) into shutdown mode.
GND 4, 5, 6 3,4 — Ground reference
IN 1 1 I Input power-supply pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground as listed in the Recommended Operating Conditions table and the Input Capacitor section. Place the input capacitor as close to the output of the device as possible.
NC 3, 7 — — Not internally connected
OUT 8 6 O Regulated output voltage pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground; see the Recommended Operating Conditions table and the Output Capacitor section. Place the output capacitor as close to output of the device as possible.
Thermal pad — Connect the thermal pad to a large-area GND plane for improved thermal performance.